- Compact style
- Indico style
- Indico style - inline minutes
- Indico style - numbered
- Indico style - numbered + minutes
- Indico Weeks View
Seminar given by Dr Craig Hillman (DFR Solutions)
Preliminary agenda:
Introduction to Design for Excellence
Motivation for DfX
Setting up a DfX team
Design for Manufacturability
Introduction
Industry Standard Design Rules
Printed Board
Solder Assembly
Component Technology and Packaging (BGA, QFN, CSP, etc.)
Design for Reliability
Introduction
Interconnect Strategies
Classic DfR Tools (FMEA, derating, etc)
DfR by Component Technoligy
Physics of Failure
Design for Environment
Environmental Compliance Legislation
Challenges of new materials (2nd gen Pb-free solder, halogen-free,etc)
Energy Consumption and Efficiency Requirements
Challenges of new environments (free air cooling, power down,etc.)
Environmental Packaging (minimize, reuse, recycle)
Disposal Planning
Design for disassembly, design for serviceability
Summary and Open Discussions
Slides available at https://espace.cern.ch/ph-dep-ese-tsdem/Reliability/Forms/AllItems.aspx (protected)
Useful information can be found on DfR Solutions site:
http://www.dfrsolutions.com/
This event is sponsored by ACEOLE. ACEOLE is a Marie Curie Action at CERN, funded by the European Commission under the 7th Framework Program.