Design for Manufacturability & Reliability

Seminar given by Dr Craig Hillman (DFR Solutions)

Preliminary agenda:

Introduction to Design for Excellence
    Motivation for DfX
    Setting up a DfX team
Design for Manufacturability
    Introduction
    Industry Standard Design Rules
    Printed Board
    Solder Assembly
    Component Technology and Packaging (BGA, QFN, CSP, etc.)
Design for Reliability
    Introduction
    Interconnect Strategies
    Classic DfR Tools (FMEA, derating, etc)
    DfR by Component Technoligy
    Physics of Failure
Design for Environment
    Environmental Compliance Legislation
    Challenges of new materials (2nd gen Pb-free solder, halogen-free,etc)
    Energy Consumption and Efficiency Requirements
    Challenges of new environments (free air cooling, power down,etc.)
    Environmental Packaging (minimize, reuse, recycle)
    Disposal Planning
    Design for disassembly, design for serviceability
Summary and Open Discussions

Slides available at https://espace.cern.ch/ph-dep-ese-tsdem/Reliability/Forms/AllItems.aspx (protected)

Useful information can be found on DfR Solutions site:
http://www.dfrsolutions.com/

This event is sponsored by ACEOLE. ACEOLE is a Marie Curie Action at CERN, funded by the European Commission under the 7th Framework Program.