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SUMMARY:Interconnect issues for the CMS 3-D track trigger
DTSTART;VALUE=DATE-TIME:20120503T180000Z
DTEND;VALUE=DATE-TIME:20120503T190000Z
DTSTAMP;VALUE=DATE-TIME:20130519T112704Z
UID:indico-contribution-24@cern.ch
DESCRIPTION:Speakers: Prof. TRIPATHI\, Mani (UC Davis)\nThe 3-D track trig
 ger concept being developed for the CMS upgrade involves interconnections 
 for signals to be transmitted between various layers of sensors and readou
 t electronics. In this design\, the two sensitive layers are separated by 
 an interposer\, which provides the lever arm for measuring transverse mome
 nta.  Such an assembly would require new challenges for bump-bonding of la
 rge arrays. Progress in various techniques being investigated for this pur
 pose will be presented.  Sequential bump-bonding steps using solders with 
 different melting points will be described. Plans for achieving high yield
 s in assembly will be discussed.\n\nhttp://indico.cern.ch/contributionDisp
 lay.py?contribId=24&sessionId=6&confId=154525
LOCATION:INFN Pisa
URL:http://indico.cern.ch/contributionDisplay.py?contribId=24&sessionId=6&
 confId=154525
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