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SUMMARY:From hybrids pixels to smart vertex detectors using 3D technologie
 s
DTSTART;VALUE=DATE-TIME:20120504T063000Z
DTEND;VALUE=DATE-TIME:20120504T070000Z
DTSTAMP;VALUE=DATE-TIME:20130521T010533Z
UID:indico-contribution-40@cern.ch
DESCRIPTION:Speakers: CLEMENS\, JCC (Universite d'Aix - Marseille II (FR))
 \nEven if 3D electronics suffers difficult beginnings\, industrial trends 
 are now strongly pushing that way to a production phase. Keeping in mind t
 he usual arguments of power consumption\, speed\, technology mixing\, new 
 and  less expected possibilities are now appearing.\nIn trackers world\, f
 ew attempts have been made to introduce 3D not only as an alternative to s
 hrinking technologies but also as a source of new possibilities.\nPost-pro
 cessed TSV  have yet proven to be feasible in HEP circuits allowing for ne
 w routing schemes of circuits IO without modifying the original process. O
 n the other hand\, 3D structures as part as the  chip process offers more 
 possibilities but the price to pay is the poor commercial offers.\nWith ne
 w ideas for building depleted sensors with standard MOS process\, 3D tech 
 could allow a fully integrated fabrication of future vertex chips (sensor 
 + read-out) in the same production chain.\nThis talk will try to give an i
 dea of the efforts made and of the results obtained using these 3D techniq
 ues in the scope of HL LHC R&D programs (ATLAS)\n\nhttp://indico.cern.ch/c
 ontributionDisplay.py?contribId=40&sessionId=2&confId=154525
LOCATION:INFN Pisa
URL:http://indico.cern.ch/contributionDisplay.py?contribId=40&sessionId=2&
 confId=154525
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