154525 Conferences false [["minutes", "Minutes"], ["notes", "Notes"], ["paper", "Paper"], ["poster", "Poster"], ["slides", "Slides"], ["summary", "Summary"]] Sezione di Pisa (IT) fabrizio.palla@cern.ch 15116 WIT2012 Workshop on Intelligent Trackers With the increasing capabilities of microelectronic technology, future particle detectors will be able to yield high level features that are not only simple geometrical positions or energy measurements in the sensors used. The ability to compute such high level primitives in near real-time is what we characterize as “intelligence”. This will enable the construction of detectors with novel functionalities, allowing the trigger logic or even the off-line analysis in experiments to handle immediately more complex features of the measurements. Two examples of new primitives are near real-time charged particle direction or charge clusters without pixel boundary effects. But the addition of such intelligence has practical challenges and in particular system issues must be addressed, such as material budget and power density. This Workshop would provide a discussion forum for the community of scientists and engineers working on development of intelligent devices. The objectives of the workshop will be to enhance the cross breeding of ideas, to compare concepts for incorporating intelligence in particle trackers, and to explore possibilities for application to other areas. The format of the workshop is on plenary sessions, for a duration of 2.5 days. This Workshop is the second of the series. The <a href="https://indico.cern.ch/conferenceDisplay.py?confId=68677" target="_blank"> first one </a>was held in Berkeley in 2010. Registration for the workshop will be by invitation following review of abstracts. The abstract submission deadline is January 14, 2012. Proceedings of the workshop will be published in JINST. Deadline extended to January 28, 2012. We invite submission of abstracts in the following subjects: *Applications of intelligent detectors *Coupled layer and monolithic architectures *Development of specific components *Electronic circuits (3D and conventional) on- and off-detector *High speed communication *System integration *Real time pattern recognition *Advanced Algorithms False INFN Pisa

Largo Bruno Pontecorvo 3 56127 Pisa Italy

2012-05-03T08:00:00 2012-05-05T18:00:00 2011-09-08T14:54:03 2012-07-19T06:36:21 Europe/Paris 13 false [["minutes", "Minutes"], ["notes", "Notes"], ["paper", "Paper"], ["poster", "Poster"], ["slides", "Slides"], ["summary", "Summary"]] A Low Mass On-chip Readout Scheme for Double-sided Silicon Strip Detectors Mr. HEPHY Vienna christian.irmler@oeaw.ac.at Mr. HEPHY Vienna christian.irmler@oeaw.ac.at Mr. HEPHY Vienna immanuel.gfall@oeaw.ac.at Mrs. HEPHY Vienna annekathrin.frankenberger@assoc.oeaw.ac.at Dr. HEPHY Vienna markus.friedl@oeaw.ac.at Mr. HEPHY Vienna siegfried.schmid@oeaw.ac.at INFN Pisa

Largo Bruno Pontecorvo 3 56127 Pisa Italy

2012-05-03T20:00:00 2012-05-03T21:00:00 01:00 B-factories like the KEK-B in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget inside the sensitive volume in order to minimize multiple scattering. On the other hand, front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to avoid excessive noise, which is mainly caused by the capacitive load of the input amplifiers. In order to achieve both - minimal material budget and low noise - we developed a readout scheme for double-sided silicon detectors, where the APV25 chips are placed on a single flexible circuit, which is glued onto the sensor. While the top-side strips are directly connected to the chips by wire-bonding and a small pitch adapter, those of the bottom-side are attached by two flexible circuits, which are bent around the edge of the sensor. This so-called “Origami” design will be utilized to build the Silicon Vertex Detector of the future Belle II experiment, which will consist of 4 layers made from ladders with up to five double-sided silicon strip sensors in a row. Each ladder will be supported by two carbon fiber reinforced ribs, with a very light-weight Airex styrofoam core. Placing the readout chip onto the sensor also requires sufficient cooling, which will be done by a highly efficient two-phase CO2 system. Thanks to the Origami concept, all APV chips inside the active Volume are aligned in a row and thus can be cooled by a single thin cooling pipe per ladder. We will present the concept and the assembly procedure of the Origami chip-on-sensor modules, and show results of beam tests which were performed at CERN on prototype modules. paper Paper doc http://indico.cern.ch/images/word.png word file ppt http://indico.cern.ch/images/powerpoint.png powerpoint file pdf http://indico.cern.ch/images/pdf_small.png pdf file odt http://indico.cern.ch/images/writer.png writer file odp http://indico.cern.ch/images/impress.png presentation file ods http://indico.cern.ch/images/calc.png spreadsheet file other http://indico.cern.ch/images/file_small.png unknown type file link http://indico.cern.ch/images/link.png link 2013-05-23 2013-05-24