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<announcer>
 <user>
  <title>Mr.</title>
  <name first="david" middle="" last="bourillot"></name>
  <organization>MCM-Services</organization>
  <email>david.bourillot@mcm-services.com</email>
  <userid>5</userid>
 </user>
</announcer>
<supportEmail caption="Support">lcws06@tifr.res.in</supportEmail>
<title>LCWS06 (Linear Collider Workshop 2006)</title>
<description>LCWS is a workshop organised at IISc, Bangalore to discuss accelerator and detector designs and the physics potential of High Energy Linear Colliders.
	
</description>
<participants></participants>
<closed>False</closed>
<location>
 <name>Indian Institute of Science</name>
 <address>C. V. Raman Road,
Bangalore 560012,
India</address>
 <room></room>
</location>
<startDate>2006-03-08T08:00:00</startDate>
<endDate>2006-03-13T18:00:00</endDate>
<creationDate>2006-01-03T23:33:10</creationDate>
<modificationDate>2012-03-01T14:06:43</modificationDate>
<timezone>Europe/Zurich</timezone>
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 <track>Tracking and Vertexing</track>
 <type>
  <id>0</id>
  <name>Oral</name>
 </type>
 <title>Developments for a digital TPC : the SiTPC project</title>
 <speakers>
  <user>
   <title></title>
   <name first="Paul" middle="" last="Colas"></name>
   <organization>Saclay</organization>
   <email>colas@hep.saclay.cea.fr</email>
  </user>
 </speakers>
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  <user>
   <title></title>
   <name first="Paul" middle="" last="Colas"></name>
   <organization>Saclay</organization>
   <email>colas@hep.saclay.cea.fr</email>
  </user>
 </primaryAuthors>
 <location>
  <name>Indian Institute of Science</name>
  <address>C. V. Raman Road,
Bangalore 560012,
India</address>
  <room>SSCU</room>
 </location>
 <startDate>2006-03-13T11:25:00</startDate>
 <endDate>2006-03-13T11:50:00</endDate>
 <duration>00:25</duration>
 <abstract>Results and simulations of a TPC with an endplate with a Micromegas or a GEM
amplification followed by a readout by a VLSI CMOS chip Medipix2 will be presented.
The steps in progress towards the realisation of a sizeable prototype, within the
EUDET program, will be presented: improvement of the protection against breakdown,
integration of the Micromegas grid onto the wafer (InGrid), and design of the Timepix
chip provided with a timing and/or time-over-threshold capability.</abstract>
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 <title>Paper</title>
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  <todayReference>2013-05-20</todayReference>
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