Event calendar file
3-5 May 2012
INFN Pisa
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56
Session:
Application of intelligent detectors / Coupled sensors and monolithic architectures
Track: Coupled sensors and monolithic architectures
Typical tracking systems for particle trajectory reconstruction in High Energy Physics experiments are based on different separated sensing layers, featuring pixels and/or strips sensitive elements.
In this work we propose an innovative approach to particle tracking based on CMOS Active Pixel Sensors layers, monolithically integrated in a all-in-one chip featuring multiple, stacked, fully funct
... More
Presented by Dr. Daniele PASSERI
on
3 May 2012
at
18:00
Session:
Real time pattern-recognition and advanced algorithms
Track: Real time pattern-recognition and advanced algorithms
Hardware-based pattern recognition for fast triggering on particle tracks has been successfully used in high-energy physics experiments for some time. The CDF Silicon Vertex Trigger (SVT) at the Fermilab Tevatron is an excellent example. The method used there, developed in the 1990’s at Pisa, is based on algorithms that use a massively parallel associative memory architecture to identify pattern
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Presented by Tiehui Ted LIU
on
5 May 2012
at
11:00
Session:
Posters
We describe the design of a floating gate-based MOS sensor embedded in a read-out CMOS sensing element used as a radiation sensor. The read-out cell asynchronously triggers an all-digital Ultra-Wide Band (UWB) transmitter operating in a 0-5GHz band, with a repetition frequency, which dynamically depends on the radiation level. The trigger signal ranges 20 to 30MHz, with a designed sensor input ran
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Presented by Dr. Alessandro GABRIELLI
on
3 May 2012
at
20:00
Session:
Posters
Addressing challenges of triggering in the High Luminosity LHC environment require development of fast and efficient track-based triggering methods. We consider a dedicated electronics-based system, which could be used as a co-processor performing fast tracking using data from the pixel detector for events passing the CMS Level-1 trigger. In this scenario, a list of tracks above a certain threshol
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Presented by Jason GILMORE
on
3 May 2012
at
20:00
Session:
On-module electronic circuits (3D and conventional), intra-module and off-detector communication
Track: On-module electronic circuits (3D and conventional), intra-module and off-detector communication
A viable seeded track trigger for a high rate collider detector environment must have excellent angular precision, response times commensurate with beam crossing rate and low mass. We have designed a fast clustering block servicing 128 contiguous strips to be included in an LHC upgrade silicion strip readout ASIC with these objectives in mind. The block is based on the presence of an analog f
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Presented by Mr. Mitch NEWCOMER
on
4 May 2012
at
15:00
Session:
Posters
We present a fast general-purpose algorithm for high-throughput clustering of data ”with a two dimensional organization”. The
algorithm is designed to be implemented with FPGAs or custom electronics. The key feature is a processing time that scales
linearly with the amount of data to be processed. This means that clustering can be performed in pipeline with the readout, without
suffering fr
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Presented by Matteo Mario BERETTA
on
3 May 2012
at
20:00
Session:
Application of intelligent detectors / Coupled sensors and monolithic architectures
Track: Applications of intelligent detectors
Selecting interesting events with triggering is very challenging at the LHC due to the busy hadronic environment. Starting in 2014 the LHC will run with an energy of 14TeV and instantaneous luminosities which could exceed 10^34 interactions per cm^2 per second. The triggering in the ATLAS detector is realized using a three level trigger approach, in which the first level (L1) is hardware based and
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Presented by Dr. Bjorn PENNING
on
3 May 2012
at
09:30
The upgrade of the LHC machine is planned to deliver luminosities 5 to
10 times larger than the design one of 1e34 cm-2s-1. A novel tracking
system for the CMS experiment must be designed and built. One main
aspect of the current activities consists in understanding the
capabilities that different designs such a tracker would have to
provide for the Level 1 hardware trigger to complement the
... More
Presented by Emmanuele SALVATI
on
3 May 2012
at
14:30
Experience at high luminosity hadrons collider experiments shows that tracking information enhances the trigger rejection capabilities while retaining high efficiency for interesting physics events. The design of a tracking based trigger for the High Luminosity LHC (HL-LHC) is an extremely challenging task, and requires the identification of high-momentum particle tracks as a part of the Level 1 T
... More
Presented by Gaelle BOUDOUL
Session:
Application of intelligent detectors / Coupled sensors and monolithic architectures
Track: Applications of intelligent detectors
Experience at high luminosity hadrons collider experiments shows that tracking information enhances the trigger rejection capabilities while retaining high efficiency for interesting physics events. The design of a tracking based trigger for the High Luminosity LHC (HL-LHC) is an extremely challenging task, and requires the identification of high-momentum particle tracks as a part of the Level 1 T
... More
Presented by Gaelle BOUDOUL, Gaelle BOUDOUL
on
3 May 2012
at
10:00
Session:
Posters
B-factories like the KEK-B in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget inside the sensitive volume in order to minimize multiple scattering. On the other hand, front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to avoid excessive noise, which is mainly caused by the ca
... More
Presented by Mr. Christian IRMLER
on
3 May 2012
at
20:00
Session:
Real time pattern-recognition and advanced algorithms
Track: Real time pattern-recognition and advanced algorithms
For the planned high luminosity upgrade of the Large Hadron Collider,
aiming to increase the instantaneous luminosity to 5-7 x 10^34/cm^2/s,
the implementation of a first level track trigger has been proposed,
which could be installed in the year 2020/21 along with the complete
renewal of the ATLAS Inner Detector.
The fast readout of the hit information from the Inner Detector is
consider
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Presented by Andre SCHOENING, Sebastian SCHMITT
on
5 May 2012
at
09:00
Session:
Real time pattern-recognition and advanced algorithms
Track: On-module electronic circuits (3D and conventional), intra-module and off-detector communication
The increase in the LHC luminosity and the reduction of the pixel size foreseen for the ATLAS pixel upgrade leads to an increased amount of data generated by the pixel detector at each beam crossing.
The bandwidth of the readout should be upgraded to deal with this increase of data, to keep a good detector efficiency.
Another approach, studied at LAPP, consists in decreasing the amount of data,
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Presented by Teddy TODOROV
on
5 May 2012
at
08:30
Session:
Posters
A digital architecture for fast sparsified readout has been developed for the implementation of wide 3D pixel sensors. The Italian VIPIX collaboration is realizing two prototypes exploiting the Tezzaron-Chartered vertical integration process in order to build a 12k-pixel 3D deep n-well MAPS sensor, and a 3D 4k-pixel front-end chip, with 50 um pitch, for a fully depleted silicon sensor. In both cas
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Presented by Dr. Filippo Maria GIORGI
on
3 May 2012
at
20:00
Session:
Application of intelligent detectors / Coupled sensors and monolithic architectures
Track: Coupled sensors and monolithic architectures
The capability of performing quick recognition of particles with high transverse momentum (more than a few GeV/c) in the inner tracker is deemed essential to keep the CMS trigger rate at an acceptable level at a higher luminosity LHC (L > 10^34 cm-2 s-1). We present an architecture for a novel tracking module based on a combination of a pixelated sensor with a short strip sensor that would offer s
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Presented by Duccio ABBANEO
on
3 May 2012
at
15:00
Session:
On-module electronic circuits (3D and conventional), intra-module and off-detector communication
Track: Real time pattern-recognition and advanced algorithms
The grouping of data elements based on characteristic relations is known as clustering.
It can either be used for data compression in a DAQ chain, or even to calculate the characteristic trigger input values based on event data.
Driven by the requirements of the PXD detector in the Belle II experiment @KEK/Japan, a real-time clustering engine was developed.
This software-inspired hardware
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Presented by Andreas WASSATSCH
on
4 May 2012
at
12:30
Session:
Posters
The proposed mu3e experiment will study the lepton flavor violating decay mu->eee which is strongly (10^-50) suppressed in the standard model, but enhanced to observable levels in many models for new physics. In order to achieve the proposed branching ratio sensitivity of 10^-16 the detector has to have high rate capability and good background suppression, which in turn requires excellent momentum
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Presented by Dirk WIEDNER
on
3 May 2012
at
20:00
Session:
Application of intelligent detectors / Coupled sensors and monolithic architectures
Track: Coupled sensors and monolithic architectures
Active pixel sensors in high-voltage CMOS technologies combine the possibility to equip the sensor segments with complex electronics and a drift-based signal collection. High radiation tolerance has been demonstrated, which makes the technology interesting for LHC applications.
We have designed a small pixel sensor demonstrator that can be readout using existing pixel or strip-readout systems. I
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Presented by Dr. Ivan PERIC
on
3 May 2012
at
17:30
The design of a positron emission tomography (PET)detection module capable of working inside a magnetic resonant imaging (MRI) system is the main objective of the INFN 4D-MPET project. Simultaneous PET/MRI technology offers better soft tissue contrast and lower radiation doses by providing both functional and morphological information at the same time. The detector will be based on Silicon Photomu
... More
Presented by Dr. nahema MARINO, Nahema MARINO, Nahema MARINO
on
3 May 2012
at
15:30
Session:
Application of intelligent detectors / Coupled sensors and monolithic architectures
Track: Applications of intelligent detectors
The combination of gaseous detectors with pixel readout chips gives unprecedented hit resolution (improving from O(100 um) for wire chambers to 10 um), as well as high-rate capability, low radiation length and giving in addition angular information on the local track. These devices measure individually every electron liberated by the passage of a charged particle, leading to a large quantity of da
... More
Presented by Dr. Nigel HESSEY
on
3 May 2012
at
11:30
Session:
On-module electronic circuits (3D and conventional), intra-module and off-detector communication
Track: On-module electronic circuits (3D and conventional), intra-module and off-detector communication
We preset a design of a front end ASIC that combines a level 1
trigger and normal event readout. It uses asynchronous logic through
out the design to reduce both power consumption and noise sensitivity.
The only clock used is the 40 MHz LHC clock. A test chip based on
this design is planned to be submitted in July of this year.
Presented by Dr. Marvin JOHNSON, Marvin JOHNSON
on
4 May 2012
at
12:00
Session:
On-module electronic circuits (3D and conventional), intra-module and off-detector communication
Track: On-module electronic circuits (3D and conventional), intra-module and off-detector communication
We present the design of a new version of the CBC (CMS Binary Chip) ASIC for the readout of CMS Tracker Phase-two upgrade. CBC2, designed in 130nm CMOS, doubles the input channels to 254 and will be bump-bonded to the substrate. The ASIC is designed to instrument double layer modules in the outer tracker, consisting of two overlaid silicon sensors with aligned microstrips, and incorporates the log
... More
Presented by Davide BRAGA
on
4 May 2012
at
14:30
Session:
Posters
We propose to enhance the performances of tracking layers by building a sandwich of low power time-integrating CMOS pixel sensors. Sensors equipping one side of the layer offer a high spatial resolution (few μm), while the sensors on the other side focus on the time resolution (few μs). The whole device targets a material budget lower than 0.5 % of X0.
We will present the in-beam test results o
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Presented by Jerome BAUDOT
on
3 May 2012
at
20:00
Session:
Development of critical technologies and system integration
Track: Development of critical technologies and system integration
on
4 May 2012
at
10:30
Session:
On-module electronic circuits (3D and conventional), intra-module and off-detector communication
on
4 May 2012
at
17:30
on
3 May 2012
at
16:30
Session:
Application of intelligent detectors / Coupled sensors and monolithic architectures
Track: Applications of intelligent detectors
The LHCb experiment is dedicated to the search for new physics
signatures in beauty and charm decays. The selection of interesting
signal events requires accurate measurements of decay lifetimes
and reconstruction of complex vertex topologies. The VErtex LOcator (VELO)
has been designed to fulfill these functions, by providing tracking
information close to the proton-proton collision reg
... More
Presented by Dr. Tomasz SZUMLAK
on
3 May 2012
at
12:30
Even if 3D electronics suffers difficult beginnings, industrial trends are now strongly pushing that way to a production phase. Keeping in mind the usual arguments of power consumption, speed, technology mixing, new and less expected possibilities are now appearing.
In trackers world, few attempts have been made to introduce 3D not only as an alternative to shrinking technologies but also as a s
... More
Presented by JCC CLEMENS
on
4 May 2012
at
08:30
Session:
On-module electronic circuits (3D and conventional), intra-module and off-detector communication
Track: Real time pattern-recognition and advanced algorithms
The TimePix3 chip, currently being designed, is a pixel read-out chip with precision tdc (< 2 ns) recording hit arrival times and time-over-threshold. The read-out architecture [1] allows for
continuous and trigger-free readout of sparsely distributed data with the rate up to 20 Mhits cm^-2 s^-1. It is designed for both solid-state pixel sensors and gaseous detectors. When used with gaseous dete
... More
Presented by Vladimir GROMOV
on
4 May 2012
at
15:30
Session:
Development of critical technologies and system integration
Track: Development of critical technologies and system integration
The upgrade of the CMS tracker at the HL-LHC will require the design of new front-end modules. These tracker modules will embed new front-end flip-chip ASICs that will be bump bonded to high density substrates, and those will be directly wire bonded to the tracker sensors. The resulting hybrid circuits will concentrate the module data flow and feed an optical transmitter module (GBT) that will be
... More
Presented by Georges BLANCHOT
on
4 May 2012
at
10:00
Session:
Application of intelligent detectors / Coupled sensors and monolithic architectures
Track: Applications of intelligent detectors
The planned high luminosity upgrade for the LHC (SLHC), will increase the collision rate in the ATLAS detector by approximately a factor 5 beyond the present LHC design goal, while also increasing the number of pile-up collisions in each event by a similar factor. This means that
the level-1 trigger must achieve a higher rejection factor in a more difficult environment. We describe a possibl
... More
Presented by David WARDROPE
on
3 May 2012
at
12:00
Session:
Posters
The 3-D track trigger concept being developed for the CMS upgrade involves interconnections for signals to be transmitted between various layers of sensors and readout electronics. In this design, the two sensitive layers are separated by an interposer, which provides the lever arm for measuring transverse momenta. Such an assembly would require new challenges for bump-bonding of large arrays. Pr
... More
Presented by Prof. Mani TRIPATHI
on
3 May 2012
at
20:00
Session:
Development of critical technologies and system integration
Track: Development of critical technologies and system integration
Multi-chip Modules - Deposited (MCM-D) technology can be applied to
silicon strip modules and promises advantages in terms of integration
complexity and material budget. The principle is to deposit
alternating dielectric and metal layers directly on the silicon
sensor, building up a PCB like structure. With lithographic techniques
traces and vias are etched with high resolution creating a cir
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Presented by Lars EKLUND
on
4 May 2012
at
09:30
Session:
Posters
In HEP experiments the use of pixel detectors requires that high power density in the sensitive area (up to 2 W/cm2) should be carried away by efficient thermal systems, eventually integrated in the light mechanical support structures.
The micro-channel cooling technology is featured by a highly efficient thermal exchange and it can profit by the miniaturization technique applied on composite
... More
Presented by Filippo BOSI
on
3 May 2012
at
20:00
Session:
Posters
Optical links will be an integral part of intelligent tracking systems at various scales from coupled sensors through intra-module and off detector communication. These links will be particularly useful if they utilize light modulators which are very small, low power , high bandwidth, and are very rad-hard.
Because of concern with the reliability, bandwidth, power, and mass of future o
... More
Presented by David UNDERWOOD, Bob STANEK, Dr. Waruna FERNANDO
on
3 May 2012
at
20:00
Session:
Posters
Monolithic Active Matrix with Binary Counters (MAMBO) IV ASIC has been designed for detecting and measuring low energy X-rays from 6-12keV. A nested well structure with a buried n-well (BNW) and a deeper buried p-well (BPW) is used to electrically isolate the detector from the electronics. BNW acts as an AC ground to electrical signals and behaves as a shield. BPW creates a homogenous electric fie
... More
Presented by Farah KHALID
on
3 May 2012
at
20:00
Session:
On-module electronic circuits (3D and conventional), intra-module and off-detector communication
Track: On-module electronic circuits (3D and conventional), intra-module and off-detector communication
The data transfer rate from highly granular tracking detectors are limited today by the available bandwidth in the readout links what prevents the detectors to be used for fast triggering.
MMwave technology is the next generation wireless technology that can provide multi-Gbps wireless connectivity for short distances between electronics [1]. Since the carrier frequency is higher (60 GHz), mor
... More
Presented by Mr. Hans Kristian SOLTVEIT
on
4 May 2012
at
16:30
Session:
Posters
In an environment with high occupancy and continuous collisions, conventional readout of silicon strip detectors will lead to ambiguities in the time domain. This problem can in principle be minimized by reducing the shaping time, but that approach is limited by the noise penalty.
The APV25 chip, originally developed for the CMS experiment, includes an on-chip switched capacitor filter performi
... More
Presented by Dr. Markus FRIEDL
on
3 May 2012
at
20:00
Session:
Posters
The capability to perform extremely fast track reconstruction online is becoming more and more important for the LHC upgrade as well as the next generation of HEP experiments, where the expected instantaneous luminosities (in excess of 10^34 /cm^2/s) and the very low signal/background ratio ask for fast and clean identification of the main characteristics of interesting events.
The Slim5 R&D proj
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Presented by Prof. Mauro VILLA
on
3 May 2012
at
20:00
Novel types of "intelligent" trackers provide hits consisting of position-cum-direction rather than position alone.
We study several types of track finding algorithms in this context, for example the Hough transform, neural networks, a cellular automaton, track following, and the combinatorial Kalman filter. The performance of the algorithms is compared on simulated data in a simplified detector
... More
Presented by Dr. Rudolf FRüHWIRTH
on
5 May 2012
at
11:30
Session:
Posters
We present updated results of prototyping silicon and carbon foam composite wafers for use as either low mass interposers or active hybrids. Composite 4 inch wafers have been prototyped with approximately 4 mm thickness and average density 20% that of silicon. A composite wafer consists of top and bottom silicon face-plates on a carbon foam core, assembled with adhesive that can withstand 300 C pr
... More
Presented by Mauricio GARCIA-SCIVERES
on
3 May 2012
at
20:00
Session:
Posters
In the last decade, the use of standard deep submicron CMOS technologies for the implementation of monolithic active pixel sensors for HEP experiments has been thoroughly investigated. One of the main issues with this approach is the fact that the charge collection efficiency may be negatively affected by the presence of competitive N-wells used to integrate PMOS transistors in the readout chain.
... More
Presented by Dr. Stefano ZUCCA
on
3 May 2012
at
20:00
Session:
Posters
The FF-LYNX protocol represents an innovative and flexible solution for the distribution of Timing, Trigger and Control (TTC) signals and the data readout in future detectors for the High Energy Physics. Transmitter (TX) and Receiver (RX) interfaces to serial electrical links implementing the FF-LYNX protocol with different speed options (160Mbps, 320Mbps, 640Mbps) have been developed. They are av
... More
Presented by Guido MAGAZZU
on
3 May 2012
at
20:00
Session:
On-module electronic circuits (3D and conventional), intra-module and off-detector communication
Track: On-module electronic circuits (3D and conventional), intra-module and off-detector communication
Parallel optical engine allows a compact design for high-speed data transmission. The design is enabled by the readily available high-speed VCSEL arrays. With the use of a 12-channel array operating at 10 Gb/s per channel, a parallel optical engine can deliver an aggregated bandwidth of 120 Gb/s. With the spacing of 250 mm between two VCSELs, the width of a VCSEL array is only 3 mm. This allows th
... More
Presented by Prof. KK GAN
on
4 May 2012
at
17:00
Session:
Posters
Commencing work on the 3D-integrated circuits in the High Energy Physics (HEP) community, which coincided with the appearance at the same time of first commercial 3D-IC design kits, whetted the appetite of the community and raised confidence in the rapid rollout of 3D-IC technology, which undoubtedly introduces a new quality to integrated readout system for the detectors. The Fermilab team was in
... More
Presented by Grzegorz DEPTUCH
on
3 May 2012
at
20:00
Session:
Posters
The PANDA experiment will make use of antiproton cooled beams of unprecedented quality, that will become available at the Facility for Antiproton and Ion Research (FAIR) in Darmstadt, featuring up to 2•10^11 antiprotons and momentum between 1.5 – 15 GeV/c.
To handle forward particle distribution due to the Lorentz boost, the apparatus is arranged in an asymmetric layout around the interaction
... More
Presented by Daniela CALVO
on
3 May 2012
at
20:00
Session:
On-module electronic circuits (3D and conventional), intra-module and off-detector communication
Track: On-module electronic circuits (3D and conventional), intra-module and off-detector communication
Given charge spread in particle detection and charge sharing between multiple detecting elements, clusters of hit pixels are inevitable in pixilated detectors, and the problem is, of course, worse for smaller pixel sizes. At the same time, in order to optimize the detective quantum efficiency (DQE) and the throughput, it is important to produce one and only one “winning” pixel address per hit
... More
Presented by Jim HOFF
Session:
On-module electronic circuits (3D and conventional), intra-module and off-detector communication
The CBC is a 130 nm CMOS chip designed for the readout of short silicon microstrips for the CMS Phase II tracker upgrade. It is a 128 channel wire-bonded chip which can be DC coupled to sensors of either polarity. The replacement tracker is also expected to provide limited tracking information to the Level 1 hardware trigger. With a binary front end the chip is well suited to adapting for use in s
... More
Presented by Mark PESARESI
on
4 May 2012
at
11:30
Session:
Posters
Modern experiments search for extremely rare processes hidden in much larger background levels. As the experiment complexity and the accelerator backgrounds and luminosity increase we need increasingly complex and exclusive selections. We present the first prototype of a new Processing Unit, the core of the FastTracker processor for Atlas, whose computing power is such that a couple of hundreds o
... More
Presented by Daniel MAGALOTTI
on
3 May 2012
at
20:00
Session:
Development of critical technologies and system integration
Track: Development of critical technologies and system integration
Future intelligent tracking systems are likely to require large area sensor modules with
finely segmented, intelligent readout. However conventional module construction, with
readout bonded at the periphery and significant sensor dead area, makes it difficult
to build large area pixelated modules with good yield,low mass and small dead area. The
combination of 3D active edge sensors and 3D (
... More
Presented by Marvin JOHNSON, Dr. Ronald LIPTON
on
4 May 2012
at
09:00
Session:
Real time pattern-recognition and advanced algorithms
Track: Real time pattern-recognition and advanced algorithms
We describe a VLSI processor for pattern recognition based on Content Addressable Memory (CAM) architecture,
optimized for on-line track finding in high-energy physics experiments.
We have developed this device using 65 nm technology combining a full custom CAM cell with standard-cell control logic.
The customized design maximizes the pattern density, minimizes the power consumption and impleme
... More
Presented by Alberto ANNOVI
on
5 May 2012
at
10:00
Session:
Posters
The new e$^{+}$e$^{-}$ colliders impose unprecedented demands to the performance of the vertex detectors. To achieve the required resolution in the vertex reconstruction, besides highly segmented pixel detectors, the material budget has to be kept at very low levels to reduce the multiple Coulomb scattering. These requirements are even more challenging in the case of the new Japanese Super Flavour
... More
Presented by Dr. Carlos MARINAS PARDO
on
3 May 2012
at
20:00
Session:
Application of intelligent detectors / Coupled sensors and monolithic architectures
Track: Applications of intelligent detectors
The LHCb experiment is making strong strides towards the exploitation of physics opportunities that may lead to the discovery and elucidation of physics beyond the Standard Model. While LHCb will be able to measure many interesting channels in the upcoming few years, an upgrade aimed at increasing its sensitivity by about a factor of 10 will broaden the discovery potential of the experiment. Tw
... More
Presented by Marina ARTUSO, marina ARTUSO, Marina ARTUSO
on
3 May 2012
at
10:30
Session:
Real time pattern-recognition and advanced algorithms
Track: Real time pattern-recognition and advanced algorithms
Modern high energy physics experiments search for extremely rare processes hidden in much larger background levels. As the experiment complexity, the accelerator backgrounds and luminosity increase we need increasingly exclusive selections to efficiently select the rare events inside the huge background.
In the framework of the CMS experiment at LHC one of the identified challenges for future upg
... More
Presented by Daniel MAGALOTTI
on
5 May 2012
at
09:30
