AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Name: AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors
Start: 2013-04-08T09:00:00+02:00
End: 2013-04-09T15:10:00+02:00
Location: LNF

8–9 Apr 2013

LNF

Europe/Zurich timezone

Event Description
Workshop Abstract
Timetable
Detailed agenda
Contribution List
Author List
How to get LNF
Accommodation
BUS SERVICE
Internet Access at INFN-LNF
Book of Abstracts
Registration
Participant List
Meeting Poster
Job Offers
Curriculum Vitae
AIDA Second Annual Meeting
AIDA-Student Tutorial

Support

AIDA-info@cern.ch

Micro bump-bonding and TSV 3D integration expertise at Fraunhofer IZM

8 Apr 2013, 17:40

20m

LNF, Auditorium Touschek

Through-Silicon Vias (TSV)

Thomas Fritzsch (Fraunhofer IZM)

Slides

2013-04-08_AIDA_Frascati_IZM.pdf

AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Support

Micro bump-bonding and TSV 3D integration expertise at Fraunhofer IZM

LNF, Auditorium Touschek

Speaker

Presentation materials

Choose timezone

AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Support

Speaker

Presentation materials

Share this page

Direct link

Social networks

Calendaring