AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Session

Frontiers in Interconnections

9 Apr 2013, 12:40

LNF

Conveners

Frontiers in Interconnections

• Michael Campbell (CERN)

39. Shrinking 3D ICs - Capabilities and Frontiers of Through Silicon Via Technologies

Armin Klumpp (Fraunhofer EMFT)

09/04/2013, 12:40

56. Unconventional fabrication approaches create opportunities for 3D integration

Andreas Fischer (KTH)

09/04/2013, 13:00