Speaker
Andrey Elagin
(University of Chicago)
Description
In order to bring the price down of MCP-based detectors such as
the LAPPD$^{TM}$, we are developing an assembly process
that does not involve an expensive vacuum transfer. This process
requires making a hermetic seal between the top window and the
detector body during the detector bake-out in vacuum. We have
demonstrated a robust technique to make a hermetic indium vacuum seal
between a glass window and detector body along the 90-cm-long
perimeter. In this technique, two flat glass surfaces with
pre-deposited thin metalization `tie' layers are bonded together by an
indium solder at the bake-out temperature of $\sim$300C. We discuss
the metallurgy of the seal in which thin metallization layers on glass
have been exposed to molten indium at high temperatures over an
extended period of time.
Primary authors
Andrey Elagin
(University of Chicago)
Eric Spieglan
(University of Chicago)
Evan Angelico
(University of Chicago)
Henry Frisch
(University of Chicago)
Robert Jarrett
(Indium Corporation)
