RD50 CMOS Sensor Meeting

Thursday 23 Sept 2021, 11:00 → 13:00 Europe/Zurich

Zoom

11:00 → 11:10 RD50-MPW2 - Measurements

• New results

11:10 → 11:30 RD50-MPW3 - Logistics

• LFoundry preparing a quotation for us at the moment
• Requested area is 5.1 mm x 7.6 mm (39 mm^2)
• Requested resistivities are standard (1 wafer), 1.9 kohm.cm (2 wafers) and 3 kohm.cm (2 wafers)
• Common irradiation campaign (neutrons and protons?)
• Proposal for sample distribution

11:30 → 12:00 RD50-MPW3 - Design

• Update on baseline pixel and double column
• Update on peripheral readout electronics (EOC, CU, I2C, wishbone, etc.) and verification
• Update on test structures and alternative pixel flavours
• Bias block and analogue buffer
• Pad ring

12:00 → 12:05 AOB

• Presentation at VERTEX conference
• Abstract planning for VCI conference (https://vci2022.hephy.at/)