Speaker
Description
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for an upgrade of the CMS tracking detector to cope with the increased radiation levels while maintaining the excellent performance of the existing detector.
Specifically, new high-radiation tolerant solid-state pixel sensors, capable of surviving irradiation fluencies up to a $ 2.0 \times 10^{16} \: n_{eq}/cm^2$ at $\approx$ 3 cm from the interaction point, need to be developed.
To this extent an R&D program involving different vendors have been launched, aiming at the development of thin n-in-p type pixel sensors.
The R&D covers both planar (Fondazione Bruno Kessler, FBK - Hamamatsu Photonics, HPK - LFoundry) and single-sided 3D columnar (FBK and Centro Nacional de Microeletronica, CNM) pixel devices.
The target active thickness is 150 $\mu m$ while two different pixel cell dimensions are currently investigated (25 $\times$ 100 and 50 $\times$ 50 $\mu m^2$).
Prototypes of hybrid modules have been bump-bonded to the RD53A readout chip (ROC), the first prototype of the ROC that will be employed during HL-LHC operation.
Test beam studies, both of thin planar and 3D devices, have been performed by the CMS collaboration at the CERN, DESY and Fermilab test beam facilities. Results of modules performance before and after irradiation (up to $ 2.0 \times 10^{16} \: n_{eq}/cm^2$) will be reported.
| Primary experiment | CMS |
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