Conveners
Pixel Sensors and Monolithic Devices: Pixel Sensors and Monolithic Devices
- Ricardo Marco Hernandez (Instituto de Fisica Corpuscular (ES))
The AC-LGAD technology has been shown to be a very promising technology within HEP due to it's extremely good time resolution and 100% fill factor. This technology is proposed to be used with the Timepix4 ASIC for imaging applications using soft X-rays. The fabrication of these devices is underway. Simulation studies have been performed to optimize the technology for a 55um pixel pitch and a...
In this work the properties of 200 $\mu m$ thick highly pixelated LGAD sensors bonded to a Timepix3 readout ASIC were characterised for the first time. Recent advances in the control of the LGAD fabrication process by Micron Semiconductor Ltd has allowed the manufacture of highly segmented devices where each pixel has an internal gain. Devices with 55 $\mu m$ pixel with 5 $\mu m$ Junction...
Where we present the characterization of the HVCMOS MPW2 chip pixel matrix using the ion microprobe station at the RBI 1 MV Tandetron accelerator with protons at 2 MeV. The proton beam spot (most probable area of impact) was around 30 um2, small enough to scan pixel by pixel the whole pixel matrix and with energy low enough to avoid SEE effects.
In high energy physics, the silicon pixel sensors manufactured in commercial CMOS chip fabrication lines have been proven to have a good radiation hardness and spatial resolution. Along with the mature manufacturing techniques and the potential of large throughput provided by the foundries, the so called "passive CMOS" sensor has become an interesting alternative to standard planer...
Passive CMOS pixel sensors are investigated in the context of the CMS Phase2 Tracker Upgrade. A prototype production of RD53A compatible pixel sensors was recently completed at LFoundry in 150nm CMOS process. This presentation will focus on the characterization of irradiated and non-irradiated pixel modules, composed by a CMOS passive sensor interconnected to a RD53A chip. The sensors are...
The new ATLAS Inner Tracker (ITk) sub-detector is necessitated by the impending High Luminosity Large Hadron Collider (HL-LHC) upgrade. This replacement is part of the phase-II upgrade programme for the HL-LHC which will see a sevenfold increase in peak instantaneous luminosity with a total ionizing dose of 53 MRad. The fully solid state ITk will employ silicon n+-in-p microstrip sensors in...
