TWEPP 2011 Topical Workshop on Electronics for Particle Physics

Advanced Packaging (Part 2)

30 Sept 2011, 16:10

1h

Kontaktraum (Vienna, Austria)

Oral TUTORIAL - Advanced Packaging (Part 2)

Speaker

Mr VAL

Description

• Requirements to and technologies for IC packaging. • Overview of different packaging technologies and their specific applications. • Packaging for high reliability applications. • Pitfalls and challenges in IC Packaging. • Advanced 3D packaging (chip on chip / die on die / etc.).