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Jun 17 – 21, 2024
CERN
Europe/Zurich timezone

Development of adhesive-based pixel-detector hybridisation concepts

Jun 19, 2024, 1:15 PM
15m
500/1-001 - Main Auditorium (CERN)

500/1-001 - Main Auditorium

CERN

400
Show room on map

Speaker

Peter Svihra (CERN)

Description

A reliable and cost-effective interconnect technology is required for the development of hybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and die sizes of the respective applications. This contribution presents recent results of an in-house single-die interconnection process based on Anisotropic Conductive Adhesives (ACA), which is under development within the CERN EP R&D programme and the AIDAinnova collaboration. The ACA interconnect technology replaces solder bumps with conductive micro-particles embedded in an epoxy layer applied as either film or paste. The electro-mechanical connection between the sensor and ASIC is achieved via thermo-compression of the ACA using a flip-chip device bonder. The ACA technology can also be used for ASIC-PCB/FPC integration, replacing wire bonding or large-pitch solder bumping techniques. This contribution introduces the developed interconnect processes and showcases different hybrid assemblies produced and tested.

Type of presentation (in-person/online) in-person presentation
Type of presentation (scientific results or project proposal) Presentation on scientific results

Primary authors

Dr Ahmet Lale Alexander Volker (KIT - Karlsruhe Institute of Technology (DE)) Dominik Dannheim (CERN) Eric Buschmann (Brookhaven National Laboratory (US)) Giovanni Calderini (LPNHE-Paris, Centre National de la Recherche Scientifique (FR)) Haripriya Bangaru Helge Kristiansen (Conpart AS) Janis Viktor Schmidt (KIT - Karlsruhe Institute of Technology (DE)) Justus Braach (CERN, Hamburg University (DE)) Mateus Vicente Barreto Pinto (Universite de Geneve (CH)) Matteo Centis Vignali (FBK) Peter Svihra (CERN) Xiao Yang (CERN)

Presentation materials