May 18 – 22, 2025
Peppermill Reno
US/Pacific timezone

M2Or4B-05: [Invited] Advances in iron-based superconductors for high-field applications

May 20, 2025, 5:30 PM
30m
Naples 4/5

Naples 4/5

Speaker

Chiheng Dong (Institute of Electrical Engineering, Chinese Academy of Sciences)

Description

Driven by their exceptional superconducting performance at high fields, iron-based superconductors have been the focus of sustained efforts toward practical applications. However, challenges persist in fabricating high-performance iron-based superconducting long wires and tapes fabricated by the powder-in-tube method. Recent studies have identified key factors limiting the current-carrying capacity: poor grain connectivity and lack of strong pinning centers. Through innovative grain boundary engineering and stress-driven dislocation pinning, a new record high critical current density of Jc=4.5×105 A/cm² has been achieved at 4.2 K and 10 T. In addition, benefiting from the well-established mass production of high-quality precursors, the 100-meter-long tapes have demonstrated homogeneous Jc values exceeding the practical application threshold (105 A/cm²) at 4.2 K and 10 T. Building on these high-performance long tapes, an iron-based superconducting insert pancake coil successfully generated a one-tesla magnetic field at a background field of 20 T. Collectively, these advancements strongly indicate a promising future for the application of iron-based superconductors at high magnetic fields.

Author

Chiheng Dong (Institute of Electrical Engineering, Chinese Academy of Sciences)

Co-authors

Chao Yao (nstitute of Electrical Engineering, Chinese Academy of Sciences) Meng Han (Institute of Electrical Engineering, Chinese Academy of Sciences) Dongliang Wang (Institute of Electrical Engineering, Chinese Academy of Sciences) Xianping Zhang (Institute of Electrical Engineering, Chinese Academy of Sciences) Yanwei Ma (Institute of Electrical Engineering, Chinese Academy of Sciences)

Presentation materials

There are no materials yet.