Name: RD50 CMOS Sensor Meeting
Start: 2024-09-19T11:00:00+02:00
End: 2024-09-19T12:40:00+02:00
Location: Zoom

- 11:00 → 11:10
  News 10m
  - New chip readout boards delivered at CERN. Boards will NOT be distributed to institutes until Ricardo receives payment details from everybody who requested boards.
- 11:10 → 11:50
  RD50-MPW4 - Test beam preparation 40m
  - Annealing of wafer 3 irradiated samples: agreed to follow procedure for 'sweet spot' (80 minutes at 60°C)
  - Potentially use PCM packs (Phase Change Materials) for transport, T is not guaranteed
  - Ask if we can use freezers at DESY on arrival (somebody needs to be there on arrival during weeked)
  - Lab evaluation before test beam (I-Vs topside vs. backside bised, S-curves, trimDAC calibration, at a few different T)
  - Modifications of cooling setup
  - Have radiation protection office measure irradiated samples and produce document for DESY
  - Eurolabs paperwork is in preparation
  eval-irradSamples.pdf
- 11:50 → 12:10
  
  RD50-MPW4 Testbeam results 20m
  
  Detailed MedAustron testbeam results
  
  Speakers: Bernhard Pilsl (Austrian Academy of Sciences (AT)), Harald Handerkas (HEPHY)
  
  hvcmos_meeting_19.09.24_MAUS_TB_results.pdf
- 12:10 → 12:15
  
  AOB 5m