Signal and Power Integrity using Ansys Electronics Desktop: Practical Case Studies

by Francesco Martina (INFN Lecce e Universita del Salento (IT))

Tuesday 13 May 2025, 09:00 → 10:00 Europe/Zurich

13/2-005 (CERN)

HYBRID SEMINAR IN 13-2-005 AND ZOOM

Abstract:

This tutorial offers an overview of typical SI and PI challenges encountered during high-frequency board layout development. In particular, 3D ElectroMagnetic solvers can be used to optimise PCB transmission line geometries for signal integrity, board-to-connector transitions, and impedance matching. The presentation will be delivered with the software at hand, illustrating the environments best suited for these purposes. Additionally, a power integrity analysis will be presented for a module integrating a wire-bonded high-speed serialiser ASIC.

Zoom details are also in the invitation email.

Make sure you have the latest Zoom client app to be able to connect https://cern.zoom.us/ -> Download client