Draft by Gunn

Present:

Gunn, Mark, William, Chiara, Lauren

Discussion:

• Idea is to go ahead with this new electrode design (with bent wing shape)
• The original plan of using SPS instrument is very likely out of question due to heat load of 80 Watt that we don't know where it ends up (Hikmet is checking)
• The new plan is to go with a Tee or a cross vacuum chamber that way avoid impedance issue as Chiara proposed
• Cathode size: idea is to keep long cathode of 150mm and insert from side, to be realisting with what we will install in LS3, we should stick to long cathode.
• William will do some backward palnning to see if we can fit anything realisting
• Check with main workshop on what opetions are feasible in given short time
• Mark will send 3D model of how the timepix3 chip is mounted with feethrough
• Mark will check for the vacuum acceptance of UHV glue for the timepix
• Gunn will check minimum length needed for the cathode to see if this meets the field uniformity requirement.
• We can go away with 20 kVDC instead of 30 kVDC, this reducing the ceramic spacer size and gap between cathode and beam screen.
• Once a 3D model is ready by ML, hikmet can carry out RF impedance simulations. 
• XEI provides exact needs and parameter/dimentions for the BGI instrument (e.g. high voltage gaps etc)