Draft:

Present:

Mark, Gunn, James, Chiara, Laurene, Student Stage

Discussion:

• Laurene presented first design of the LHC BGI instrument with 80mm beam pipe and modulated cathode shape
• High voltage feethrough hole too large, can be made smaller by adding ceramic guide
• Big question is chip thermal contact - glue ? Is there acceptance test done by William ?
• Discussion on number of flanges, at the moment there are 4 vacuum seals - anode block, cathode block, HV and chip, can we not reduce the one for chip ? 
• Another concern is that the volume around timepix needs discussion as there is also wire bonding step