Initial Discussion on Samples to Be Tested — 29/07/2025

Devices Under Test (DUT)

• All DUTs are diode-type devices; no dedicated ASICs.

• TI‑LGADs (V1): fresh and irradiated.

• 3D devices: fresh and irradiated 3D‑trenched from FBK (AIDAInnova), and DS 3D‑columnar from IMB‑CNM (RD50).

Points to Clarify

• Status of the irradiated 3D samples at CERN and JSI (irradiation point, radioprotection clearance).

Front-End / Readout

• UCSC boards + second‑stage amplifier (per Vagelis’ suggestion: https://is.gd/z440ot).
  Note: the second stage reduces SNR by approximately ½ according to the specifications.

Sample Availability — To Clarify

• How many fresh and irradiated samples are available at CERN?

• How many fresh and irradiated samples are available at JSI?

• How many UCSC boards are available?

Sample Packaging

• Can packaging be performed at CERN for the 3D‑trenched devices?

• Can packaging be performed at IFCA or JSI for the 3D‑columnar devices?

DAQ

• Proposal to use a Tektronics MS064‑6B available from the CERN Electronics Pool.
  Vagelis suggests the following arrangement: https://is.gd/jl5j5C