Attendees: Daphne Vassilena Beaujoint, Kieran Geiger, Gonzalo Hernando Irisarri, Javier Osuna, Juan Carlos Perez, Vendela Catharina Roxenborg, Vincent Schenk, Ezio Todesco.

Here a few points or which we agreed:

• the date will change as some person can definitely not attempt this one: next one will be on Wednesday morning
• meetings will happen on an every 2 weeks basis and physical presence is highly encouraged
• these meetings will not require any formal presentation, we focus on discussion and brainstorming with nothing more than pictures to share as illustration if necessary.
• the meetings will have 2 forms depending on each meeting
  • a simple status update of activities at engineering levels
  • it should be organized according to projects and not the persons
  • the filling of the shared word document will definitely help structuring this tour de table
  • a brainstorm/discussion over a specific transversal topic
  • topics can be proposed by anybody and will be announced in the invitations
  • gathering a smaller audience of persons interested and/or willing to share on the topic
  • example (as proposed by Javier): How to implement de-sizing in magnet fabrication and adapt the tool design?

Here a re few more comments rising from our discussion:

• regular engineers coffee times blocked in the calendar
• chat platform for engineers (we used to have a mattermost, it's not perfect)
• the tour de table might become less and less necessary or could be done less formally with time letting more spots for topical discussion

For the next meeting, we will keep going with the tour de table specially for the absents from the first one.  I will try to have listed the different projects/activities of the section with the people attached to it.

Tour de table

• Vincent Schenk 
  • PU jacks for alignement, almost done
  • Polab box program, starting, update in 3 weeks
  • Iter High Voltage wire
  • Wax impregnation
• Daphne Vassilena Beaujoint
  • patty for thermal contact of SHIP cable
• Javier Osuna
  • Insulation in coils: interlayer or cable insulation, msc seminar next week
• Kieran Geiger
  • CHIC project: winding, former manufacturing and brazing trials on-going
• Gonzalo Hernando Irisarri
  • production follow-up of MCBXF: 4 magnets missing
  • Faro arm measurements and shimming plan preparation
• Vendela Catharina Roxenborg
  • 2D FEM analysys for BOND (Ansys APDL)
  • 3D coming soon
• Juan Carlos Perez
  • HL-LHC: MCBXF, D1
  • HFM: RMM, BOND, CIEMAT collab, CEA collab
• Ariel Haziot
  • Technology dev. Prog.: SMC, SMC-Hybrid engineering design, MQXFS ESC coil fabrication
  • Fusillo, test on going
  • Winding area supervison: E-mip implentation