Draft:

Present:

Giuceppe, Mark, James, Gunn, Cesar

Discussion:

• Mark presents slides, starting with BGI introduction
• Outstanding issue is how to mechanically atatch the chip to the base such that it conducts heat generated from chip operation
• Staystick 672 is not an option (bakeout @120 degree C), see EDMS 2618330 (2021 by Swann) & EDMS 1879485 (2018 by Nicola)
• Staystick 101, too hot for sensor, not good
• Masterbond SUP121AO, possible option
• Brazing and mechanical options also discussed but less preferres due to difficulties and reducing effective detection area.
• Silicon vias (solder bond balls), possibly work but low theraml conduction surface
• Allectra Glue4, identified as a good option -> good theraml conductivity and curing temperature ok, bakeable
• Cesar and Giuseppe agreed to do some sample tests for the Allectra Glue4. in vacuum, bakeout/curing/outgessing
• SY-BI will order the Allecra Glue4 and provide it to TE-VSC for the tests

Other references:

1. Ceramic microchannels (LTCC): https://indico.cern.ch/event/1535828/contributions/6486309/attachments/3085211/5462044/250612_Ceramics.pdf