Jun 1 – 5, 2026
Hotel Hermitage
Europe/Rome timezone
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Structural Design and Thermal Performance Study of CEPC Beam Pipe Based on an Aluminum Tube Substitution Scheme

Jun 3, 2026, 4:30 PM
20m
Maria Luisa (Hotel Hermitage)

Maria Luisa

Hotel Hermitage

57037 Portoferraio (LI) Isola d’Elba Italy https://www.hotelhermitage.it/en/home

Speaker

Xiaoyan Ma (Chinese Academy of Sciences (CN))

Description

As one of the core components of CEPCr, the structural design and thermal management of the beam pipe directly impact beam quality and experimental safety. This study addresses the process validation requirements during the development of the beam pipe by proposing an experimental scheme that uses an aluminum pipe as a substitute for the conventional beryllium pipe. The beam pipe adopts a double-layer structure, with an inner tube wall thickness of 0.2 mm, an outer tube wall thickness of 0.15 mm, and a gap of 0.2 mm between the inner and outer tubes. To verify the feasibility of the substitution, the mechanical properties, thermal conductivity, and irradiation characteristics of aluminum and beryllium were first compared, clarifying the differences in their physical properties. Subsequently, a thermal-structural coupling model of the beam pipe was established using the finite element method, and the temperature field distribution and heat dissipation performance of the aluminum pipe and the beryllium pipe were compared under identical thermal load conditions. The results show that, although aluminum differs from beryllium in thermal conductivity, it can still meet the heat dissipation requirements of the experimental stage through structural optimization. Based on these findings, the structural design and process feasibility assessment for the aluminum pipe substitution scheme were completed. This study provides critical process validation and design references for subsequent practical engineering applications utilizing beryllium pipes.

Authors

Xiaoyan Ma (Chinese Academy of Sciences (CN)) Mr Xiaohui Qian (IHEP,CAS) Mr Jian Wang (IHEP,CAS)

Presentation materials