Speaker
Description
Next-generation vertex detectors for experiments such as ALICE ITS3, FCC-ee, and EIC demand a novel mechanical approach to achieve unprecedented tracking precision. This requires a radical reduction in material budget and positioning the first detection layer closer to the interaction point. Within the DRD8 collaboration (WP1), we have developed an ultra-light, wafer-scale curved silicon pixel architecture following the ALICE ITS3 baseline. This concept, developed by the ALICE collaboration, utilizes 65 nm TPSCo CMOS imaging technology and stitching to create large-scale sensors. The design integrates ultra-thin sensors (thickness ≤ 50 μm) onto carbon foam structures that provide extremely low mass with adequate structural rigidity. These structures serve as both mechanical supports and thermal radiators, ensuring superior heat dissipation for thermally critical regions and enabling a self-supporting geometry with a first-layer radius of 19 mm and a total length of 266 mm.
This study presents the results of a systematic campaign conducted through a series of iterative engineering prototypes to validate the full concept development: from the mechanical assembly of curved sensors, service routing, and delicate component interconnectivity through the patch panel, to thermal and vibrational performance characterisation. We report key performance parameters, including a material budget of the overall mechanics X/X₀ < 0.05%. Experimental data confirms sub-micron aeroelastic stability (displacement < 1 μm) and validates an innovative air-cooling solution, achieving a peak temperature rise of ΔT < 7°C at 8 m/s airflow, eliminating the need for liquid-cooling infrastructure. Finally, we present the status of the Qualification Model, assembled with final-grade components and real sensors, representing the final milestone for system-level deployment in future collider experiments.