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SUMMARY:DRD3/DRD7 Workshop on 3D Integration Technologies
DTSTART:20260922T063000Z
DTEND:20260922T190000Z
DTSTAMP:20260916T014000Z
UID:indico-event-1712740@indico.cern.ch
DESCRIPTION:Speakers: Fabian Huegging (University of Bonn (DE))\, Giovanni
  Calderini (LPNHE-Paris\, Centre National de la Recherche Scientifique (FR
 ))\, Michele Caselle (INFN Bari and University of Foggia)\, Laci Andricek 
 (MPG HLL)\, Dominik Dannheim (CERN)\n\nThe 2026 ECFA-DRD3/DRD7 Workshop on
  3D Integration Technologies provides a forum to discuss recent progress\,
  emerging concepts\, and future opportunities in advanced packaging\, wafe
 r-level integration\, and low-mass module technologies for semiconductor d
 etectors at future collider experiments.\nThe Workshop brings together exp
 erts from the high-energy physics community and industry to review ongoing
  developments in 3D integration\, wafer-to-wafer bonding\, hybrid bonding\
 , interconnect technologies\, silicon interposers\, and advanced detector-
 module assembly techniques.\nThe morning session focuses on applications a
 nd R&D progress in the detector community\, highlighting progress and pers
 pectives from ongoing DRD3-WG7 and DRD7.6b projects.\nThe afternoon sessio
 n is dedicated to industrial perspectives\, advanced technological solutio
 ns\, and specialised equipment relevant to 3D integration and next-generat
 ion detector-module fabrication.\n\nhttps://indico.cern.ch/event/1712740/
LOCATION:CERN
URL:https://indico.cern.ch/event/1712740/
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