11-15 February 2013
Vienna University of Technology
Europe/Vienna timezone

Performance of the CLAS12 Silicon Vertex Tracker module

Not scheduled
Vienna University of Technology

Vienna University of Technology

Gußhausstraße 25-29, 1040 Wien (Vienna), Austria
Board: 53
Poster Semiconductor Detectors


Yuri Gotra (Thomas Jefferson National Accelerator Lab)


For the 12 GeV upgrade, the CLAS12 experiment has designed a Silicon Vertex Tracker (SVT) using single sided microstrip sensors fabricated by Hamamatsu. The sensors have graded angle design to minimize dead areas and a readout pitch of 156 μm, with intermediate strip. Double sided SVT module hosts three daisy-chained sensors on each side with total strip length of 33 cm. There are 512 channels per module read out by four Fermilab Silicon Strip Readout (FSSR2) chips featuring data driven architecture, mounted on a rigid-flex hybrid. Modules are assembled on the barrel using unique cantilevered geometry to minimize amount of material in the tracking volume. Design and performance of the SVT modules is presented, focusing on results of electrical measurements.
quote your primary experiment CLAS12 TJNAF

Primary author

Yuri Gotra (Thomas Jefferson National Accelerator Lab)

Presentation Materials