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14:30
Introduction
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Hans-Günther Moser
(Max-Planck-Institut für Physik)
Valerio Re
(INFN)
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14:45
3D integration activities at CERN
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Michael Campbell
(CERN)
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15:00
3D integration activities at Bonn/CPPM
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Laura Gonella
(Universitaet Bonn (DE))
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15:15
3D integration activities at INFN
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Lodovico Ratti
(University of Pavia)
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15:30
Status of MAPS developments at Strasbourg and plans for fine pitch CMOS wafers 3D interconnections
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Wojciech Dulinski
(Institut Pluridisciplinaire Hubert Curien (FR))
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15:55
3D integration activities at LAL/LAPP/LPNHE/MPP
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Abdenour Lounis
(Universite de Paris-Sud 11 (FR))
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16:05
3D integration activities at University of Barcelona
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Eva Vilella
(University of Barcelona)
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16:20
3D integration activities at MPP/GLA/LAL/LIV/LPNHE
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Anna Macchiolo
(Max-Planck-Institut fuer Physik (Werner-Heisenberg-Institut) (D)
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16:35
Results at CPPM-Bonn with 3D Tezzaron-Chartered technology
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Theresa Obermann
(Universitaet Bonn (DE))