May 14 – 16, 2014
University of Pennsylvania
US/Eastern timezone

R&D on detector components using 3D IC for LHC upgrades and other future detectors

May 16, 2014, 9:00 AM
25' presentation + 5' for discussion

25' presentation + 5' for discussion

Oral presentation


Julia Thom (Cornell University)


Three dimensional integrated circuit technologies offer the possibility of fabricating large area arrays of sensors integrated with complex electronics with minimal dead area, which makes them ideally suited for applications at the LHC upgraded detectors and other future detectors. We describe the ongoing R&D efforts to demonstrate functionality of components of such detectors. This includes testing of TSV technology, fabrication and testing of silicon or glass interposer structures to assemble arrays that integrate and match the pitch of large area sensors with arrays of readout integrated circuits, as well as the study of integrated 3D electronics with active edge sensors to produce "active tiles" which can be tested and assembled in to arrays of arbitrary size with high yield. The latter includes studies of possible post-processing to achieve active edges without the complexity of silicon-on-insulator sensor assemblies.

Primary authors

Chris Kenney (SLAC) Dr Grzegorz Deptuch (Fermi National Accelerator Lab. (US)) Julia Thom (Cornell University) Leonard Spiegel (FNAL) Prof. Mani Tripathi (UC Davis) Marvin Johnson (FNAL) Meenakshi Narain (Brown University (US)) Peter Siddons (BNL) Dr Ronald Lipton (Fermi National Accelerator Lab. (US)) Sherwood Ira Parker (University of Hawai'i at Manoa (US)) Ulrich Heintz (Brown University (US)) Zhenyu Ye (Fermi National Accelerator Lab)

Presentation materials