Feb 15 – 19, 2016
Vienna University of Technology
Europe/Vienna timezone

Prototype sensors for intelligent module with integrated on-chip logic using strip and pixel sensors for CMS tracker phase-II upgrade

Not scheduled
Vienna University of Technology

Vienna University of Technology

Gusshausstraße 27-29, 1040 Wien
Board: 43
Poster Semiconductor Detectors


Johannes Grossmann (Austrian Academy of Sciences (AT))


he high luminosity upgrade of the LHC is targeted to deliver 2500 fb-1 at a luminosity of 5x10E34 cm-2s-1. Higher granularity, 140 collisions per bunch crossing and existing bandwidth limitations require a reduction of the amount of data at module level. New modules have binary readout, on-chip pT-discrimination and capabilities to provide track finding data at 40 MHz. The CMS collaboration has undertaken R&D effort to develop new planar sensors for the pixel-strip module, which has to withstand 1x10E15 1 MeV neutron equivalent flux in the innermost layer of the tracker. The module is composed of a strip sensor and a macro pixel sensor with 100 μm × 1.5 mm pixel size. Sensors were characterized in the laboratory and the effects of different process parameters on planar n-in-p sensor concepts were studied. Module prototypes were built, noise studies on a new type of module design for the PS module were performed and beam tests of the first prototype assemblies are done. Status and progress of this effort will be discussed.

Primary author

Johannes Grossmann (Austrian Academy of Sciences (AT))

Presentation materials