Conveners
B18-Vertexing at future accelerators
- Francesco Forti (Universita di Pisa & INFN (IT))
Valerio Re
(Universita e INFN, Pavia (IT))
30/09/2016, 18:00
Electronics and system integration
Invited Talk
In the past ten years, 3D vertical integration technologies have generated a wide interest in the silicon pixel sensors and front-end electronics communities. They have the potential to lead to the fabrication of multilayer high performance devices with no dead area, where each layer is optimized for its function (particle sensing, analog signal amplification and filtering, digital memory and...
