Minutes from WADAPT vidyo meeting on October 11th, 2016-10-11

Participants : R. Brenner, C. Dehos, S. Dittmeier, E. Locci, A. Schoening, H.K Soltveit, K. Ullaland, D. Wiedner

1 – News

There were two short presentations from Hans Kristian and Cedric (see slides)

The schematic design and layout of the chip is fully ongoing in Heidelberg. Bergen will collaborate in the test-board development. Hans Kristian will give a talk at GSI Darmstadt on December 13th.

LETI has developed a contactless connector able to reach 5Gbps and 10Gbps occasionally (short range).

2 – Discussion

In our last meeting in June, a short term plan was discussed and some itemps were listed :

• Basic requirements from the detector side given by the demonstrator application. Possibly a replacement of the GBT or intewgration on detector module -  André & Richard

It was decided that a dedicated GBT meeting among experts should be organized to define the specifications for the interface.

• Updated time scale for finalizing ASIC and plan for testing the new ASIC  - Hans Kristian

See HK slides

• Specifications of the LETI ASIC and availability for the demonstrator – Cédric

Cedric’s e-mail, July 4^th

Following our last Wadapt meeting, I have asked our industrial partner for the use of our co-developed transceiver chip in the Wadapt framework.

A first version of the chip is already available and functional. A second version is expected for October with improved performance.

They answer positively on the following points:

- Datasheet and Application Note can be delivered on request after signature of a Non-Disclosure Agreement.

- A limited number of test boards can be provided for a while for test and interfacing with your electronics.

- Chip samples can be used for radiation test purpose.

Moreover CEA Leti is eager to support any initiative linked with the use of this chip.

Feel free to come back to me if you are interested.

• CERN rules for forming a R&D Collaboration – Elizabeth

See E. slides

3 – Commitments

• Schematic design and layout of the chip – Hans Kristian

Finished mid-December

• Irradiation tests – Richard & al.

Richard takes the responsibility of coordinating the radiation tests. Before starting any tests some preliminary work has to be done. The delivery of the chip has to be scheduled. The chip and the conditions of irradiation need to be studied. The test facilities have to be defined and the test periods scheduled.

Richard will circulate a document describing all the issues by Xmass.

This will be a good opportunity to work together as a Collaboration.

• R&D

André and possibly Richard will discuss with Eckhard Elsen in order to find out which structure would be the most appropriate for the future development of our Collaboration and for getting funding.

Our next meeting will be scheduled in January