3-8 September 2017
The Open University, Milton Keynes, UK.
Europe/London timezone

Characterisation of capacitively coupled HV/HR-CMOS sensor chips for the CLIC vertex detector

Sep 8, 2017, 9:20 AM
Berrill Lecture Theatre (OU)

Berrill Lecture Theatre (OU)

The Open University, Walton Hall, Milton Keynes, MK7 6AA


Iraklis Kremastiotis (KIT - Karlsruhe Institute of Technology (DE))


The capacitive coupling between an active sensor and a readout ASIC has been considered in the framework of the CLIC vertex detector study. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is a High-Voltage CMOS sensor chip produced in a commercial $180$ nm HV-CMOS process for this purpose. The sensor was designed to be connected to the CLICpix2 readout chip. It therefore matches the dimensions of the readout chip, featuring a matrix of $128\times128$ square pixels with $25$ $\mu$m pitch. The sensor chip has been produced with the standard value for the substrate resistivity (of $\sim20$ $\Omega$cm) and characterised in standalone testing mode, before receiving and testing capacitively coupled assemblies. The standalone measurement results show a rise time of $\sim20$ ns for a power consumption of $2.7$ $\mu$A/pixel.

Following the successful characterisation of the C3PD ASICs produced with the standard substrate resistivity a second submission took place, with higher substrate resistivity wafers ($\sim20$, $80$, $200$, and $1000$ $\Omega$cm). The higher resistivity, along with a layout modification done in order to achieve a higher breakdown voltage, are expected to have beneficial results on the sensor performance. A comparison of the performance of the sensor with different substrate resistivities will be presented.

C3PD ASIC and measured $^{55}$Fe spectrum.

Primary authors

Iraklis Kremastiotis (KIT - Karlsruhe Institute of Technology (DE)) Rafael Ballabriga Sune (CERN) Michael Campbell (CERN) Dominik Dannheim (CERN) Adrian Fiergolski (CERN) Daniel Hynds (CERN) Szymon Kulis (CERN) Ivan Peric (KIT - Karlsruhe Institute of Technology (DE))

Presentation materials