In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system.
The n-on-p silicon technology is a promising candidate to achieve a large area instrumented with
pixel sensors, since it is radiation hard and cost effective.
The paper reports on the performance of thin (100 and 130 $\mu m$ thick) and...
The ATLAS experiment will undergo around the year 2025 a replacement of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) with a new 5-layer pixel system.
Thin planar pixel modules are the baseline technology to instrument all layers of the new pixel system, with the exception of the innermost one, thanks to their high charge collection efficiency after irradiation...
The ATLAS tracking detector will be upgraded with the Inner Tracker (ITk) for the High-Luminosity Large Hadron Collider (HL-LHC) at CERN. The tracking system will be fully made of radiation hard silicon sensors. A process modification in a standard 0.18 micron CMOS imaging technology combines small, low capacitance electrodes of around 2 fF for the sensor with a fully depleted active sensor...
In the resent development of pixel detectors for the ATLAS Inner Tracking detector upgrade, thin planar pixle detector has been developed and ready for the production. A half size readout ASIC, RD53A, which supposed to be the last prototype before the pre-production chip is available. The RD53A chip compatible sensors are developed at KEK/HPK in Japan and flip-chiped modules are tested by...
