10-16 June 2018
Dalhousie University
America/Halifax timezone
Welcome to the 2018 CAP Congress Program website! / Bienvenue au siteweb du programme du Congrès de l'ACP 2018!

Preferred orientation of electroplated copper films on roll-annealed copper substrates

12 Jun 2018, 14:30
15m
SUB 302 (cap.40) (Dalhousie University)

SUB 302 (cap.40)

Dalhousie University

Oral (Non-Student) / Orale (non-étudiant(e)) Surface Science / Science des surfaces (DSS) T3-7 Surface Sciences (DSS) I Science des surfaces (DSS)

Speaker

Delilah Brown (Mount Allison University)

Description

Roll-annealed (RA) copper foils are commonly used in the printed circuit industry as flexible conductive base materials. The RA process produces foils with the crystallites aligned in particular directions. RA foils used in applications have either {100}<001> “cube” texture, or a mixture of {112}<111> “copper”, {123}<634> “s” and “cube” textures. Manufacturing circuits requires the deposition of electroless and galvanic Cu layers on the RA foils. The substrate texture can lead to growth of large epitaxial crystals with a rough surface, which causes problems in subsequent processing steps. We show that with an appropriately designed electroless Cu interlayer, the deposit texture is sufficiently suppressed and a smooth galvanic layer is obtained. We present XRD pole figure based analysis of substrates and electroless/galvanic deposits.

Primary author

Delilah Brown (Mount Allison University)

Co-authors

Ralf Bruening (Mount Allison University) Tobias Bernhard (Atotech Deutschland GmbH) Sebastian Zarwell (Atotech Deutschland GmbH)

Presentation Materials