In recent years, the aging of metal structures has become a problem in various social infrastructures that form the basis of livelihood and production. Therefore, various inspections are performed on metal structures to evaluate their degree of fatigue and the remaining life. Residual stress is one of the indicators for evaluating the soundness of metal structures, and many evaluation technologies have been developed since long ago. However, there are few conventional residual-stress-measurement methods used for on-site measurement, but they have destructive nature of inspection and take long measurement time. Therefore, we have developed a high-speed and compact X-ray residual-stress-measurement device equipped with a high-sensitivity, high-definition, charge-integration type silicon-on-insulator (SOI) pixel detector, INTPIX4, and we studied quality-evaluation techniques for metal materials.
Previous studies have shown that residual stress can be measured in less than 1 second by using a measurement device with an SOI pixel detector. In this study, we will introduce the characteristics of the installed INTPIX4, specification of the measurement device, and the technology for analyzing the detected X-ray images. Furthermore, we will report technologies on the data-processing methods for analyzing and measuring residual stress, aiming to evaluate the soundness of metal structures and inspect machines and metal products.
|Submission declaration||Original and unpublished|