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Discussion of TSV processing in 65 nm CMOS wafers

Name: Discussion of TSV processing in 65 nm CMOS wafers
Start: 2019-03-26T10:00:00+01:00
End: 2019-03-26T11:00:00+01:00
Location: No location set

Tuesday 26 Mar 2019, 10:00 → 11:00 Europe/Zurich

- 10:00 → 11:00
  
  AIDA2020 WP4 plans with TSV in RD53A wafers 1h
  
  Speakers: Fabian Huegging (University of Bonn), Fabian Huegging (University of Bonn (DE)), Thomas Fritzsch (Fraunhofer IZM), Valerio Re (Universita and INFN (IT))
  
  TSV_discussion.pdf
  
  TSV_discussion.pptx

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Discussion of TSV processing in 65 nm CMOS wafers

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