Present: Hampus, James, Josh.

PS BGI

Actions from previous meeting

Done:

James & Josh will prepare the tank for the BE-RF impedance measurement on Wednesday 20th May, with Friday 22nd authorised in case of problems.
Swann sent Didier the MkIII detector STEP files for incorportation into the CATIA model.
James contacted Wil concerning aC coating.
Hampus contacted Christos & William to setup the design review for the SFP+ FMC mezzanine.

Still To-Do:

Communicate in-vacuum electronics assembly & wire-bonding requirements ( Swann when he returns ).
Status of flex cables ( Swann when he returns ).

Mechanics

Meeting last week with Emilien Rigutto to discuss production of the upgraded BGI-Horizontal mechanics. Idea is to produce enough parts for 3 x complete instruments, using 2 x spare vacuum flanges & re-using an existing flange assembly. Action: Check stock of Dsub-, Dsub-78 & Kings-HV electrical vacuum feedthroughs (James & Josh).

Readout electronics & Software

We will have a mini-workshop on the morning of Wednesday 10th June ( date t.b.c. ) to review: the instrument functional requirements; firmware; software drivers; FESA classes; Expert GUI & analysis software. The aim will be to evaluate our current status; identify improvements & generally to promote understanding & communication between all involved.
Requests for electronic design office / production work should be communicated directly by the requester to the design office, with William in 'cc. Action: Hampus to communicate jobs for 1) SFP+ FMC board design & production & 2) VPB / QuadGBTx design update & production.
Steen & Hampus need a FEC & back-end to be setup in 865 for FESA & driver developments. Action: Hampus to do this week of Monday 29th May.

SPS BGI

Actions from previous meeting

Still To-Do:

Move new HV system to 867 and setup instrument & SILECS to provide HV control (James, Josh & Hampus).

PCB design almost complete. Would be good if Swann could take a look when he's back.
Design for a mechanical holder has been developed based on extruted pieces (from https://lincolnbinns.com/customisation/custom-aluminium-enclosures/custom-e-case-enclosures.html), which includes an ecosystem of parts to allow, for example, connectiotion to DIN rails. Casing above the Timepix3-BLM will be removed and replace with a window with low material budget - to be decided what. All connectors ( RJ45, power, bias & DAC-OUT ) are on one side. Possibility to use similar mechanics to combine more than one PCB "layer" in a box to create a telescope-like configuration.

To help co-ordinate tasks between us - particularly during teleworking - we will try again to use the BGI Trello board.