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SUMMARY:Massively parallel\, three-dimensional photon counting: a versatil
 e tool for quantum experiments
DTSTART;VALUE=DATE-TIME:20190329T100000Z
DTEND;VALUE=DATE-TIME:20190329T110000Z
DTSTAMP;VALUE=DATE-TIME:20190320T120328Z
UID:indico-event-804844@indico.cern.ch
DESCRIPTION:CMOS SPADs have appeared in 2003 and soon have risen to the st
 atus of image sensors with the creation of deep-submicron SPAD technology.
  The format of these image sensors has expanded from 8x4 pixels of our fir
 st LIDAR in 2004 to 512x512 pixels of recent time-resolved cameras\, and t
 he applications have literally exploded in the last few years\, with the i
 ntroduction of proximity sensing and portable telemeters. SPAD based senso
 rs are today in almost every smartphone and the promise is that they will 
 be in every car by 2022. The introduction of SPADs in 3D-stacked ICs in 20
 15 is pushing the potential of this technology even further. The inherentl
 y digital nature of SPADs and the increased density of processing and comp
 utation over multiple silicon layers will soon enable deep-learning proces
 sors\, neural networks directly on chip\, thus enabling complex processing
  in situ and reducing the overall power consumption. Another recent trend 
 has been the use of SPADs in qubit readout and control\, thus making SPADs
  amenable to interface with quantum processors\, due to SPAD sensitivity a
 nd the capability of operating normally at cryogenic temperatures. The pre
 sentation will conclude with a technical and economic perspective on SPADs
  and SPAD imagers\, and a vision for SPADs and other cryo-CMOS circuits in
  quantum computing.\n\nhttps://indico.cern.ch/event/804844/
LOCATION:CERN 40-S2-A01 - Salle Anderson
URL:https://indico.cern.ch/event/804844/
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