ITS3 -WP5
presentation Grigory:
the performance demonstrated from -5 to +25, so 30 degrees is not an encouraging result, and is only of the matrix.
for the layer, still there is nothing on the cooling on the periphery, neither i in this test, nor in the mechanics.
the cooling option, is considered, but not yet considered in the integration.
presentation Gael:
new requirement that could show up: services and routing also from C side.due to limitation to chip design we should bring data or power or both of them we should bring also from C side. so another periphery, power could be easier but if also data we need to go whit flat FPC and if the FPC has to go along the A side , should be along the acceptance and so should be in alu...that's why alternative design are ongoing.
Picture Peter:
layer 1 and 2, glued together; working at zero, probably friday glued.no particular issue, procedure seems to work, to work a little on the tolerance on the foam.
presentation Aitor
whatever test result we obtain we should share with Akos and check with his simulation.
all parts we have, missing the 3D parts to be sent out to be produced.
to insulate the foam and the flow: armaflex or to glue other parts. to check that there is no CTE mismatch between carbon foam and the flange.
heat transfer between heaters and foam critical.to use thermal conductive glue. already studied different glues to be used, including glue with additional conductive particles.