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Timepix4 MPGD Embedding project
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Europe/Zurich
CERN (CERN)
CERN
CERN
Description
The embedding of the Timepix4 chip in MPGDs aims to create a fully integrated, high-granularity gaseous detector with enhanced spatial and temporal performance. By positioning the chip between polyimide foils and coupling it directly to amplification structures (such as Micromegas, $\mu$RWell, or GEMs), the design minimizes the distance between the readout electronics and the gas amplification stage, maximizing signal coupling and enabling precise 4D particle tracking and ionization topology studies. The resistive polyimide layer provides intrinsic discharge protection, while the embedded architecture allows the chip surface to function as the anode.
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14/02/2026 - Re-kick start of the project 2h
In this meeting, the current status of the Embedding TPX4 chips into MPGDs was discussed.
Some of the highlights were:
- David and Eliska showed a resume of the progress of the project -- see attached slides.
- Jerome is testing many chips, with these showing some variability in their quality.
- These chips require careful handling, and therefore Riccardo will provide some handling instructions.
- Also for that reason, Jerome would like to visit and possibly follow both the soldering procedure of the tpx4 at Sylvain's workshop, and well as the embedding procedure at the MPT workshop.
- Jerome will also provide additional bare samples of TPX4 v3 for follow-up embeddings at the MPT.
It was also discussed the Katherine readout system
- This system is of interest for GDD as it seems more suitable for the readout of multiple TPX4 chips, one of the endgoals of this project.
- The possibility of developing an adapator card between our carrier PCBs and Katherine was discussed. Jerome is interested in this project, and offered technical support if this is formalized.
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02/03/2026 - Soldering procedure 20m
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11/03/2026 - First tests with TPX4 + µRWell 20m
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29/06/2026 - Presentation at 8th DRD1 Collaboration Meeting 20m
Pixelated Charge Readout of Micro-Pattern Gaseous Detectors with the Timepix4 ASIC
https://indi.to/tH73b
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16/09/2026 - Presentation at the Medi/Timepix collaboration meeting - September 2026 20m
Integrating MicroPattern Gas Detectors with Timepix4
https://indi.to/Vnnn7 -
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2nd embedding - tests of inner layer - 03/11/2026 20m
2nd embedding started. Inner layer completed and tested.
- Miss-alignment found between RDL pads and copper holes.
-- Machine was miss-aligned by ~120µm. Same displacement found in inner layer. - From the 5 powerlines, one was shorted to ground.
-- Possibly due to miss-alignment - Few scratches on the pixel side, exposing the chip
- Chip possibly bended, to be measured
- Found glue dots
-- Attributed to bad glue batch
Next steps:
- Antonio suggests a new way of imaging inner layer which allows alignment by eye, through kapton transparency
- New ASICs to use provided to Antonio (by email)Miss-alignmentScratch - Miss-alignment found between RDL pads and copper holes.
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