Timepix4 MPGD Embedding project

Saturday 14 Feb 2026, 10:00 → 12:40 Europe/Zurich

CERN (CERN)

The embedding of the Timepix4 chip in MPGDs aims to create a fully integrated, high-granularity gaseous detector with enhanced spatial and temporal performance. By positioning the chip between polyimide foils and coupling it directly to amplification structures (such as Micromegas, $\mu$RWell, or GEMs), the design minimizes the distance between the readout electronics and the gas amplification stage, maximizing signal coupling and enabling precise 4D particle tracking and ionization topology studies. The resistive polyimide layer provides intrinsic discharge protection, while the embedded architecture allows the chip surface to function as the anode.

10:00 → 12:00 14/02/2026 - Re-kick start of the project

Project_resume.pdf

TPX4 Embedding progress pictures - Adam 20260216_140337.jpg 20260216_140407.jpg

TPX4 pictures - Jerome

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In this meeting, the current status of the Embedding TPX4 chips into MPGDs was discussed.

Some of the highlights were:

• David and Eliska showed a resume of the progress of the project -- see attached slides.

 

• Jerome is testing many chips, with these showing some variability in their quality.
• These chips require careful handling, and therefore Riccardo will provide some handling instructions.
• Also for that reason, Jerome would like to visit and possibly follow both the soldering procedure of the tpx4 at Sylvain's workshop, and well as the embedding procedure at the MPT workshop. 
• Jerome will also provide additional bare samples of TPX4 v3 for follow-up embeddings at the MPT.

 

It was also discussed the Katherine readout system

• This system is of interest for GDD as it seems more suitable for the readout of multiple TPX4 chips, one of the endgoals of this project.
• The possibility of developing an adapator card between our carrier PCBs and Katherine was discussed. Jerome is interested in this project, and offered technical support if this is formalized. 

 

12:00 → 12:20 02/03/2026 - Soldering procedure

Soldering_procedure_slide.pdf

Soldering procedure

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12:20 → 12:40 11/03/2026 - First tests with TPX4 + µRWell

full_setup.jpeg

hitmap_grid.jpeg

single_clusters.jpg

tpx4_on_PCB.jpeg

tpx4_with_urWell_on_top.jpeg