Bump bonding development for a Si-W calorimeter

Not scheduled
1m
Sheraton Hotel (Chicago)

Sheraton Hotel

Chicago

301 East Water Street Chicago, IL 60611
Poster Presentation Semiconductor Detectors

Speaker

Prof. Mani Tripathi (University of California (UCD))

Description

The SiD collaboration is developing a Si-W electromagnetic calorimeter for the ILC. This will be a highly segmented sampling calorimeter composed of tungsten absorber and silicon readout layers. The readout gap will have a thickness of <1 mm, which poses challenges for instrumenting the silicon wafers. Progress on various bump bonding techniques and flex cable fabrication will be presented.

Author

Prof. Mani Tripathi (University of California (UCD))

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