RD50-MPW2 - Measurements - New results

RD50-MPW3 - Logistics - Chip floorplan and chip size - Chip substrate resistivities and how many samples - RD50 funding request - RD50-MPW3 submission --> 25.10.2021

RD50-MPW3 - Design - Update on baseline pixel and double column - Update on peripheral readout electronics (EOC, CU, I2C, wishbone, etc.) and verification - Update on test structures and alternative pixel flavours - Bias block and analogue buffer - Pad ring

AOB