17th RD50 Workshop (CERN)

Session

3D sensors

18 Nov 2010, 16:00

503/1-001 - Council Chamber (CERN)

Conveners

3D sensors

• Richard Bates (Department of Physics and Astronomy)

15. Status of 3D detector productions at CNM

Dr Giulio Pellegrini (Centro Nacional de Microelectronica CNM-IMB-CSIC)

18/11/2010, 16:00

I will report on the fabrication of new 3D detectors devices for the Atlas 3D collaboration and other CERN experiments.

16. 3D Detector status at FBK

Elisa Vianello (Fondazione Bruno Kessler), Gabriele Giacomini (Fondazione Bruno Kessler)

18/11/2010, 16:20

In this talk we present the latest results from the development of double sided,double type column 3D detectors with full passing columns at FBK. The main issues related to the fabrication process and preliminary results from the electrical characterization of several test devices will be discussed.

3. 3D-FBK pixel sensors: overview of recent results with proton and neutron irradiated sensors

Mr Andrea Micelli (Universita degli Studi di Udine)

18/11/2010, 16:40

3D Silicon sensors fabricated at FBK-irst with Double-side Double Type Column approch and columnar electrodes only partially etched through p-type subtrates have been irradiated and tested in laboratory and with 120 GeV pion beam at CERN SPS. We will present an overview of recent results from laboratory tests obtained with devices irradiated with protons and neutrons up to 5x1015 neq/cm2.

4. Comparative Studies of Irradiated 3D Silicon Strip Detectors on p-type and n-type Substrate

Michael Koehler (Freiburg University)

18/11/2010, 17:00

Double-sided 3D silicon strip detectors, manufactured by CNM on p-type and n-type substrate, were measured after irradiation with sLHC strip- and pixel fluences. The device irradiations were performed at the proton cyclotron in Karlsruhe with 25 MeV protons. Results of measurements with a beta source and an infrared laser will be shown. After a radiation fluence of 2E16 n_eq/cm^2, the highest...

26. Test beam analysis on Timepix 3D pixel detector

Chris Parks (Glasgow University)

18/11/2010, 17:20

An n-type double-sided 3D detector fabricated at CNM bump bonded to a Timepix chip has been tested in a pion and a micro-focused x-ray test beams. The resulst from both test beams will be shown. The x-ray test beam shows relative detection maps of the 3D pixel device. The pion test beam results show the absolute detection efficiency, cluster size and resolution for detectors with particles...

22. Discussion on 3D sensors

Dr Chris Parkes (Glasgow), Richard Bates (Department of Physics and Astronomy)

18/11/2010, 17:40