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RD50 CMOS Sensor Meeting

Thursday 4 May 2023, 11:00 → 12:40 Europe/Zurich

Zoom

Zoom

94676963354

Eva Vilella Figueras

46926294

- 11:00 → 11:30
  RD50-MPW4 - Submission and design update 30m
  - Update on general and detailed design aspects
  - Simulations and verifications
  - Plan for the submission (date 08.05.23)
  - Requested LFoundry to replace IVD (polymide passivation) for PSiN (non-polymide passivation) to allow Rapid Thermal Annealing (450 Celsius degrees) as part of the backside processing at IBS; LFoundry is currently producing a new quotation, hence the final funding request has not been circulated yet and the PO not generated (RD50 management is aware)
  - LFoundry Tape Out Form Sheet + other details requested by LFoundry
  Speakers: Bernhard Pilsl (Austrian Academy of Sciences (AT)), Chenfan Zhang (University of Liverpool), Chenfan Zhang (University of Liverpool (GB)), Helmut Steininger (Austrian Academy of Sciences (AT)), Patrick Sieberer (Austrian Academy of Sciences (AT)), Samuel Powell (University of Liverpool (GB)), Sinuo Zhang (University of Bonn (DE)), Sinuo Zhang
  
  RD50-MPW4 wishlist
- 11:30 → 11:35
  AOB 5m
  - TWEPP conference --> abstracts deadline is 30.04.2023 (one abstract submitted)
  - PSD conference --> abstracts deadline is 01.06.2023
  - RD50 workshop --> abstracts deadline is 05.06.2023
  abstract-197.pdf
  
  PSD13
  
  RD50 WS
  
  TWEPP2023