Towards a compact light-weight and large-area pixel detector module with MALTA DMAPS

by Florian Dachs (CERN)

Tuesday 23 May 2023, 11:00 → 12:30 Europe/Zurich

6/R-012 - conference room (CERN)

The MALTA detector family offers large area DMAPS with high granularity at a 36.4um symmetric pixel pitch and radiation hardness up to 2E15 1MeV neq/cm2 while maintaining low material budget with chip thicknesses down to 50um. Work Package 1.3 of EP R&D aims to develop a light-weight large-area module using compact and mechanically robust interconnection techniques such as Anisotropic Conductive Films or nanowires. With this aim in mind, the chip-to-chip data transmission capability of Al wedge wire bonded MALTA modules has been characterised in the laboratory as well as beam tests at the SPS North Area. In parallel, an ACF bonding process for MALTA modules is being developed using an interposer to achieve compact chip-to-chip interconnections. Both efforts informed the design and production of an ultra thin flexible circuit that can receive up to 4 MALTA2 pixel detectors using either ACF or nanowires. This seminar will give an introduction to the infrastructure needed to develop MALTA modules and discuss latest beam test results. The current status of ACF bonded MALTA modules will be presented with an outlook towards first tests on the MALTA2 flex module.

Module development with CMOS pixel detectors-3.pdf