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Possible application of Photon4D technology for HL-LHC BGI

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Participants:

  • Nicolò Biesuz ( INFN Ferrara )
  • Massimiliano Fiorini ( University & INFN Ferrara )
  • Angelo Cotta Ramusino ( INFN Ferrara )
  • William Andreazza ( CERN(*) )
  • Gunn Khatri ( CERN(*) )
  • Mark Mclean ( CERN(*) )
  • James Storey ( CERN(*) )

(*) Accelerator Systems (SY) department, Beam Instrumentation(BI) group. 

 

Introduction to CERN's HL-LHC beam profile project ( James )

 

HL-LHC baseline project in SY-BI group to develop new non-destructive transverse beam profile monitors for the LHC.

Beam Gas Ionisation (BGI) profile monitors will be based on the detection of rest gas ionisation electrons, also know as Ionisation Profile Monitors (IPM's). 

Design will be an evolution of BGI instruments recently installed  in the PS (& soon SPS), based on detection of ~10 keV ionisation electrons with Timepix3 HPD's ( non-mentalized sensor. )

Interest in 4DPhoton:

  • Current PS BGI design on TPX3 assemblies in the beam pipe connected to Dsub-78 vacuum feedthroughs via flexible cables, with TPX3 dataout operating at 320 MB/s.
  • For TPX4 need to significantly improve dataout bandwidth (aiming at 5 GB/s) and minimise outgassing of components installed in the beam pipe.
  • Inspired by 4DPhoton - idea for HL LHC would be to mount TPX4 HPD on a ceramic carrier, which would also serve as the UHV / air separation.
  • Advantages = readout bandwidth + fewer components in UHV + overall much simpler instrument design

Timeline:

  • Winter shutdown 2024/25 - Installation of a prototype BGI instrument in LHC (Pt.4).
  • Operate prototype with LHC beam in 2025:
    • Test communication with TPX4 in presence of beam;
    • Evaluate effect of SEU's;
    • [ Bonus ] Measure beam inducted backgrounds ( inelastic beam gas interactions, synchrotron light, etc. ).
  • LS3 (2026-28) - Prepare 4 x instruments ( H + V on B1, H + V on B2 )
  • Run 4 (2029 - ) - Commission & operate instruments. 

Ref: https://bgi.web.cern.ch/

 

Introduction to 4DPhoton + Discussion ( All )

 

4DPhoton ceramic carrier 

  • Application of 4DPhoton ceramic carrier for the CERN HL-LHC BGI looks to be very promising. 
  • TPX4 is attached to the ceramic carrier with Staystik 672, heat removed on air side with liquid cooled heat sink.
  • TPX4 is thinned to 300um for Photon4D application ( for integration reasons ), not needed for BGI application.
  • Leak rate has been tested with EP-DT to be ~ 1e-9 mbar/l/s(?) over a period of ~1 day (?)       
  • As of today limited number of (good) ceramic carriers, but may be feasible for INFN to supply 1x good carrier for the BGI prototype and possibly some bad carriers for development purposes.
  • INFN will soon order 100 carriers (Kyocera, Japan (O)2kCHF per ceramic), but it would be possible to increase order quantity if needed. 
  • Key questions for BGI application:
    • How to braze the ceramic carrier to a stainless steel vacuum flange?
    • Can the ceramic carrier / flange assembly meet LHC vacuum requirements (e.g. leak rate, reliability, etc.)?

Actions

  • Massimiliano will send William STEP file of ceramic carrier.
  • William to contact Alessandro Saputi to discuss mechanical aspects.
  • James to setup meeting with Massimiliano to discuss collaboration practicalities.

TPX4 readout system ( All )

 

HL-LHC BGI will need a radiation tolerant readout system (~10'sGy/year).

Readout will be based on the radiation tolerant readout system for Timepix3-based PS & SPS BGI's (1kGy/year), which is based on an optical link between a radiation hard frontend (GBTx + VTRx, FEAST DC/DC) and a COTS backend (Xilinx Zynq MPSoC)

CERN plan to develop similar Timepix4 readout system (based on lpGBTx & VTRx+) in 2024, with a view to using the system to operate the LHC prototype device in 2025. 

INFN have already developed a full readout system for the Timepix4, which although not radiation tolerant (so not well suited to the LHC tunnel), could be useful for the CERN team during the development phase. 

Angelo points out that the Timepix4 is more susceptible to SEU's due to the larger number of registers.

Angelo comments that the lead time for new Timepix4 assemblies, depending on the sensor chosen, could be very long.

 

Actions

  • James to contact Jerome to start procurement of Timepix4 assemblies. 
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