Name: RD50 CMOS Sensor Meeting
Start: 2024-06-06T11:00:00+02:00
End: 2024-06-06T12:30:00+02:00
Location: Zoom

- 1
  
  News
- 2
  RD50-MPW4 - Test beam
  - Preliminary analysis
- 3
  RD50-MPW4 - Test beam with irradiated samples
  - 2nd testbeam for irradiated samples
    
    More PCBs needed
    
    Apply for DESY beam-time in autumn (~October)?
- 4
  RD50-MPW4 - Lab evaluation
  - New timing results
  - Round table
  Evaluation plan
- 5
  
  RD50-MPW4 - Caribou work
  
  MPW4_BOREAL_US.pdf
  
  MPW4_BOREAL_US.pptx
- 6
  AOB
  - DRD3 week 17-21 Jun. at CERN (abstract submission deadline 6 Jun): we plan to submit one scientific abstract on the work we have done so far and another abstract for a project proposal to further develop radiation tolerant HV-CMOS sensors.
  - TWEPP abstract accepted in track "ASIC" as an Oral presentation "RD50-MPW4: A thin backside-biased High Voltage CMOS pixel chip for high radiation tolerance".
  - For publications with irradiated samples please add the acknowledgment: "This project has received funding from the European Union's Horizon Europe Research and Innovation programme under Grant Agreement No 101057511 (EURO-LABS).", and Euro-Labs logos also in presentations. Send Igor the link and he will report to Euro-Labs. Visibility is very important.