POLAR-2 weekly meeting

Monday 10 Jun 2024, 10:30 → 12:15 Europe/Zurich

Zoom info:

https://unige.zoom.us/j/63634520102

 

• FEE Mechanics update
• FEE FW HV + Peltier 
• FEE physics part
• Updates on WP3 and WP4
• FW for LVPS hub
• ESRF beam test
• Simulation and analysis

 

 

 

 

 

 

 

 

 

MoM 20240610

 

Management

Still waiting for the POL letter of endorsement.

 

SoW

New version is being prepared at CSU, but for the moment we did not receive any update.

Johannes on his side is updating the document and will prepare a new version for Wednesday, when he will send it to CSU. The idea would be to have meeting next Friday. Philipp will send a mail about the meeting, also asking for a STEP model of the POLAR-2 environment on CSS.

 

Module

The interface boards are mounted and tested, the module will be placed back into the cylinder in the afternoon. The tests will start as soon as the vacuum levels are good enough (in 36 hours most probably).

We had a visit at Campus Biotech, to see if we can use their thermal chamber. The chamber is basically available all the time, we can use it. We need to prepare a new cylinder which can fit inside the chamber, but this should request a minimal work, so we can expect to be ready in 3 weeks from now.

Franck will contact the lab at CERN which will print the module grids and crosses. Johannes will also pass by their lab this afternoon. 

Wrapping: we will produce additional jigs, but it is important that they have a dimension corresponding to the actual bar dimensions, we will thus wait for the first batch and see how are the bars. Anyway it would be good to have a feedback from Scionics, if they can give the dimension info of the bars in production.

Mechanical modules: still to define the design such that we can recycle the pieces for the real modules.

 

FEE

FEE-04 still under examination by the company.

HPK has not given a feedback about the thermal tests of the SiPMs. It seems they can do it, they just have to confrim the temperature range (and costs).

 

BEE/PHU

Layout is being updated after the review comments. To be noted that BEE will read out RADFET chips.

 

Mechanics

Discussion with CD about the top cover design and production. Two approaches, one signle piece or 5 separate pieces glued together. In principle the top layer should be 3.25 mm and side layers should be 2.25 mm.

 

Beam test

ESRF did not assign any slot to POLAR-2. We will re-submit a request, in the mean time we will look for possible alternatives. A solution could be in Shanghai.

 

ComBox

CSU sent a document on communication, Nicolas will have to check it.

 

AOB

The summer student is arriving today.

We will need more GPIO adapters. As a first step we can use the interface board used for TVT.