Speaker
Description
As part of the CERN EP R&D programme and the AIDAinnova collaboration, innovative and scalable concepts for hybridisation and module integration are being developed for pixel detector applications in future colliders. Most interconnect processes require specific surface properties and topologies of the bonding pads. An in-house Electroless Nickel Gold (ENIG) plating process is therefore under development that can be performed at the single-die level and adapted to a wide range of pad geometries and bonding techniques. ENIG bumping is a promising solution for the next generation of hybrid detector assemblies due to the combination of chemical selectivity, reproducibility, and compatibility with existing packaging technologies. This contribution introduces the developed plating process and presents examples of the bumping results achieved for interconnect test devices, functional sensors and ASIC samples, alongside measurements of their height and uniformity.
| Type of presentation (in-person/online) | in-person presentation |
|---|---|
| Type of presentation (I. scientific results or II. project proposal) | I. Presentation on scientific results |